The Reliability Evaluation of Cu Wire Bonding by Using Focus Ion Beam System

被引：0
|
作者：
Zhang XiaoWen [1 ]
Lin XiaoLing [1 ]
Chen Yuan [1 ]
机构：
[1] Natl Key Lab Sci & Techonl Reliabil Phys & Applic, Guangzhou, Guangdong, Peoples R China
来源：
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词：
D O I：
10.1109/ICEPT.2010.5582717
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The cross sections of bonding have been made by using focus ion beam(FIB) system on the advanced chips packaged with BGA. Through the measurement of aluminum layer thickness under different bond force, the bonding reliability has been evaluated. The comparison has also been made on the interface of Au wire Bonding and Cu wire Bonding. Since the Cu wire Bonding process is more difficult, When it is used in the advanced chips, the bonding reliability should be evaluated.
引用
收藏
页码：1049 / 1052
页数：4
相关论文
共 50 条
  • [31] Current Industry Adoption of Fine-Pitch Cu Wire Bonding and Investigation Focus at iNEMI
    O'Malley, Grace
    Su, Peng
    Fu, Haley
    Bayes, Martin
    Tsuriya, Masahiro
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [32] An Evaluation of Effects of Molding Compound Properties on Reliability of Cu Wire Components
    Su, Peng
    Seki, Hidetoshi
    Ping, Chen
    Zenbutsu, Shin-ichi
    Itoh, Shingo
    Huang, Louie
    Liao, Nicholas
    Liu, Bill
    Chen, Curtis
    Tai, Winnie
    Tseng, Andy
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 363 - 369
  • [33] Au wire bonding to Cu pad using Ti thin film
    Ueno, Hiroshi
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1992, 31 (5 A): : 1547 - 1548
  • [34] Bond strength evaluation of heat treated Cu-Al wire bonding
    Shariza, S.
    Anand, T. Joseph Sahaya
    Warikh, A. R. M.
    Chia, Lee Cher
    Yau, Chua Kok
    Huat, Lim Boon
    JOURNAL OF MECHANICAL ENGINEERING AND SCIENCES, 2018, 12 (04) : 4275 - 4284
  • [35] Bond reliability under humid environment for Pd coated Cu and Ag alloy wire bonding
    Du, Yahong
    Liu, Zhi-Quan
    Xiong, Tao
    Yuan, Zhibo
    Leng, Fei
    Lv, Hailan
    Yu, Daquan
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [36] Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire
    Fan, Junling
    Yuan, Donglin
    Du, Juan
    Hou, Tao
    Wang, Furong
    Cao, Jun
    Yang, Xuemei
    Zhang, Yuemin
    MICROMACHINES, 2024, 15 (07)
  • [37] High Reliability Challenges with Cu Wire Bonding for Automotive Devices in the AEC-Q006
    Jeon, Junho
    Na, SeokHo
    Jeon, SungHo
    Mo, Mina
    Kang, DaeByoung
    Lim, Kwangmo
    Kim, JinYoung
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1968 - 1973
  • [38] Evaluation of ion/electron beam induced deposition for electrical connection using a modern focused ion beam system
    An B.-S.
    Kwon Y.
    Oh J.-S.
    Shin Y.-J.
    Ju J.-S.
    Yang C.-W.
    Applied Microscopy, 2019, 49 (01)
  • [39] Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules
    Hamidi, A
    Beck, N
    Thomas, K
    Herr, E
    MICROELECTRONICS RELIABILITY, 1999, 39 (6-7) : 1153 - 1158
  • [40] Focus Ion Beam Based Nanofluidic System for Biomolecule Characterization
    Busch, Taylor
    Ma, Bo
    Tung, Steve
    2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2014, : 55 - 59
12345