Au wire bonding to Cu pad using Ti thin film

被引：0
|
作者：
Ueno, Hiroshi [1 ]
机构：
[1] Clarion Co, Ltd, Fukushima, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1992年 / 31卷 / 5 A期
关键词：
539 Metals Corrosion and Protection; Metal Plating - 542 Beryllium; Lithium; Magnesium; Titanium and Other Light Metals and Alloys - 544 Copper and Alloys - 547 Minor; Precious and Rare Earth Metals and Alloys - 704 Electric Components and Equipment;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
10
引用
收藏
页码：1547 / 1548
相关论文
共 50 条
  • [1] AU WIRE BONDING TO CU PAD USING TI THIN-FILM
    UENO, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (5A): : 1547 - 1548
  • [2] RELIABLE AU WIRE BONDING TO AL-TI-AL PAD
    UENO, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 (5A): : 2157 - 2161
  • [3] Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition
    Jong-Ning Aoh
    Cheng-Li Chuang
    Journal of Electronic Materials, 2004, 33 : 290 - 299
  • [4] Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition
    Aoh, JN
    Chuang, CL
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 290 - 299
  • [5] Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
    Sang-Ah Gam
    Hyoung-Joon Kim
    Jong-Soo Cho
    Yong-Jin Park
    Jeong-Tak Moon
    Kyung-Wook Paik
    Journal of Electronic Materials, 2006, 35 : 2048 - 2055
  • [6] Pad bending improvement on Copper wire bonding on NiP/Pd/Au bond pad
    Heong, Tan Kian
    Kim, Teo Chen
    Yong, Wang Mei
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [7] Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability
    Gam, Sang-Ah
    Kim, Hyoung-Joon
    Cho, Jong-Soo
    Park, Yong-Jin
    Moon, Jeong-Tak
    Paik, Kyung-Wook
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (11) : 2048 - 2055
  • [8] Reliability Evaluation of Bonding between Cu Wire and Al Pad
    Ishida, Y.
    Ota, N.
    Yamashita, S.
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 630 - 633
  • [9] Effect of Cu and PdCu wire bonding on bond pad splash
    Tan, Y. Y.
    Sim, K. S.
    ELECTRONICS LETTERS, 2014, 50 (15) : 1095 - 1096
  • [10] Effect of Die Attach Material on Heavy Cu Wire Bonding with Au Coated Pd Bond Pad in Automotive Applications
    Kumar, B. Senthil
    Albert, Acuesta
    Geraldine, Lim Lay Hong
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 618 - 624
12345