Detection of electron trap generation due to constant voltage stress on high-k gate stacks

被引:20
|
作者
Young, C. D. [1 ]
Nadkarni, S. [1 ]
Heh, D. [4 ]
Harris, H. R. [2 ]
Choi, R. [1 ]
Peterson, J. J. [1 ]
Sim, J. H. [1 ]
Krishnan, S. A. [1 ]
Barnett, J. [1 ]
Vogel, E. [4 ]
Lee, B. H. [3 ]
Zeitzoff, P. [1 ]
Brown, G. A. [1 ]
Bersuker, G. [1 ]
机构
[1] SEMATECH, 2706 Montopolis Dr, Austin, TX 78741 USA
[2] AMD, Sunnyvale, CA USA
[3] IBM Corp, Armonk, NY USA
[4] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA
关键词
high-k; trap generation; charge pumping; trapped charge;
D O I
10.1109/RELPHY.2006.251211
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Positive constant voltage stress combined with charge pumping (CP) measurements was applied to study trap generation phenomena in SiO2/HfO2/TiN stacks. Using the analysis for frequency-dependent CP data developed to address depth profiling of the electron traps, we have determined that the voltage stress-induced generation of the defects contributing to threshold voltage instability in high-kappa gate stacks occurs primarily within the interfacial SiO2 layer (IL) on the as-grown "precursor" defects most likely caused by the overlaying HfO2 layer. These results point to the IL as a major focus for reliability improvement of high-kappa stacks.
引用
收藏
页码:169 / +
页数:3
相关论文
共 50 条
  • [31] Bond strain and defects at interfaces in high-k gate stacks
    Lucovsky, G
    Phillips, JC
    MICROELECTRONICS RELIABILITY, 2005, 45 (5-6) : 770 - 778
  • [32] Integration of high-k/metal gate stacks for CMOS application
    Chen, D. Y.
    Lin, C. T.
    Hsu, Y. R.
    Chang, C. H.
    Wang, H. Y.
    Chiu, Y. S.
    Yu, C. H.
    2008 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PROGRAM, 2008, : 148 - 149
  • [33] Performance and reliability of advanced High-K/Metal gate stacks
    Garros, X.
    Casse, M.
    Reimbold, G.
    Rafik, M.
    Martin, F.
    Andrieu, F.
    Cosnier, V.
    Boulanger, F.
    MICROELECTRONIC ENGINEERING, 2009, 86 (7-9) : 1609 - 1614
  • [34] Ion scattering studies of high-K gate stacks.
    Garfunkel, E
    Starodub, D
    Sayan, S
    Goncharova, L
    Gustafsson, T
    Vanderbilt, D
    Bartynski, RA
    Chabal, YJ
    Nishimura, T
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2003, 226 : U387 - U387
  • [35] Interface dipole engineering in metal gate/high-k stacks
    Huang AnPing
    Zheng XiaoHu
    Xiao ZhiSong
    Wang Mei
    Di ZengFeng
    Chu, Paul K.
    CHINESE SCIENCE BULLETIN, 2012, 57 (22): : 2872 - 2878
  • [36] Progressive breakdown characteristics of high-K/metal gate stacks
    Bersuker, G.
    Chowdhury, N.
    Young, C.
    Heh, D.
    Misra, D.
    Choi, R.
    2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, : 49 - +
  • [37] Activation of electrically silent defects in the high-k gate stacks
    Veksler, D.
    Bersuker, G.
    Watkins, M. B.
    Shluger, A.
    2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,
  • [38] Electron energy dependence of defect generation in high- k gate stacks
    O'Connor, Robert
    Pantisano, Luigi
    Degraeve, Robin
    Kauerauf, Thomas
    Kaczer, Ben
    Roussel, Phillipe
    Groeseneken, Guido
    Journal of Applied Physics, 2008, 103 (06):
  • [39] An Electron-Beam-Induced Current Investigation of Electrical Defects in High-k Gate Stacks
    Chen, J.
    Sekiguchi, T.
    Fukata, N.
    Takase, M.
    Nemoto, Y.
    Hasunuma, R.
    Yamabe, K.
    Sato, M.
    Yamada, K.
    Chikyow, T.
    DIELECTRICS FOR NANOSYSTEMS 4: MATERIALS SCIENCE, PROCESSING, RELIABILITY, AND MANUFACTURING, 2010, 28 (02): : 299 - +
  • [40] Characterization of leakage behaviors of high-k gate stacks by Electron-Beam-Induced Current
    Chen, J.
    Sekiguchi, T.
    Fukata, N.
    Takase, M.
    Chikyow, T.
    Yamabe, K.
    Hasumuma, R.
    Sato, M.
    Nara, Y.
    Yamada, K.
    2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL, 2008, : 584 - +