Design method for high reliable flip chip EGA package

被引：0
|
作者：
Saito, N [1 ]
Yamada, O [1 ]
Ono, T [1 ]
Uda, T [1 ]
机构：
[1] Hitachi Ltd, Mech Engn Lab, Tsuchiura, Ibaraki 3000013, Japan
来源：
51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE | 2001年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
An efficient design method for flip chip ball grid array (BGA) packages has been developed. This method uses design of experiment (DOE), a series of finite element (FE) stress analyses based on an orthogonal array used in DOE, and statistical analysis. By using this method to design a EGA package having 1600 pins, the warpage of the optimum packaging structure is very small and all of the reliability demands are satisfied.
引用
收藏
页码：270 / 275
页数：6
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