Reliability of flip chip EGA package on organic substrate

被引：0
|
作者：
Ahn, EC [1 ]
Cho, TJ [1 ]
Shim, JB [1 ]
Moon, HJ [1 ]
Lyu, JH [1 ]
Choi, KW [1 ]
Kang, SY [1 ]
Oh, SY [1 ]
机构：
[1] Samsung Elect Co LTD, Package Dev Team, Asan, Chungnam, South Korea
来源：
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper various reliability issues of the flip chip package on organic substrate, such as the Ist level bump joint reliabilty, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
引用
收藏
页码：1215 / 1220
页数：4
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