Selective induction heating of metallic microstructures for wafer-level MEMS packaging

被引：0
|
作者：
Froehlich, Alexander [1 ]
Hofmann, Christian [2 ]
Rochala, Patrick [1 ]
Kimme, Jonas [1 ]
Kroll, Martin [1 ]
Kraeusel, Verena [1 ]
机构：
[1] Tech Univ Chemnitz, Inst Machine Tools & Prod Proc, Professorship Forming & Joining, Chemnitz, Germany
[2] Fraunhofer Inst Elect Nano Syst ENAS, Technol Campus 3, Chemnitz, Germany
来源：
INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS | 2020年 / 63卷
关键词：
Wafer bonding; MEMS packaging; induction heating; MULTIOBJECTIVE DESIGN;
D O I：
10.3233/JAE-209121
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Considering the demand for low temperature bonding processes in packaging of micro-electro-mechanical systems (MEMS), such as accelerometers or micro mirrors, in this paper a method for selective and energy-efficient heating of metallic intermediate bonding layers by applying high-frequency electromagnetic fields with frequencies in the range of 1.0 < f < 2.0 MHz is presented. Therefore, the induction heating process was modeled and analyzed by means of numerical simulation. Additionally, heating experiments were carried out by using IR thermography in order to verify the simulation results. The developed inductor shape allows almost homogeneous heating of all metallic layers with heating rates of more than Delta T/Delta t = 150 K/s.
引用
收藏
页码：S13 / S20
页数：8
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