Selective induction heating of metallic microstructures for wafer-level MEMS packaging

被引：0

作者：

Froehlich, Alexander ^{[1
]}

Hofmann, Christian ^{[2
]}

Rochala, Patrick ^{[1
]}

Kimme, Jonas ^{[1
]}

Kroll, Martin ^{[1
]}

Kraeusel, Verena ^{[1
]}

机构：

[1] Tech Univ Chemnitz, Inst Machine Tools & Prod Proc, Professorship Forming & Joining, Chemnitz, Germany

[2] Fraunhofer Inst Elect Nano Syst ENAS, Technol Campus 3, Chemnitz, Germany

来源：

INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS | 2020年 / 63卷

关键词：

Wafer bonding; MEMS packaging; induction heating; MULTIOBJECTIVE DESIGN;

D O I：

10.3233/JAE-209121

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Considering the demand for low temperature bonding processes in packaging of micro-electro-mechanical systems (MEMS), such as accelerometers or micro mirrors, in this paper a method for selective and energy-efficient heating of metallic intermediate bonding layers by applying high-frequency electromagnetic fields with frequencies in the range of 1.0 < f < 2.0 MHz is presented. Therefore, the induction heating process was modeled and analyzed by means of numerical simulation. Additionally, heating experiments were carried out by using IR thermography in order to verify the simulation results. The developed inductor shape allows almost homogeneous heating of all metallic layers with heating rates of more than Delta T/Delta t = 150 K/s.

引用

页码：S13 / S20

页数：8

共 50 条

[41] RF-MEMS wafer-level packaging using through-wafer via technology
Tian, J.
Iannacci, J.
Sosin, S.
Gaddi, R.
Bartek, M.
EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 441 - 447
[42] Study on localized induction heating for wafer level packaging
XI YanYan 1
2MoEMS Division
Science China(Technological Sciences), 2010, (03) : 800 - 806
[43] Study on localized induction heating for wafer level packaging
XI YanYan LUO XiaoBing LIU WenMing CHEN MingXiang LIU Sheng School of Energy and Power EngineeringHuazhong University of Science and TechnologyWuhan ChinaMoEMS DivisionWuhan National Laboratory for OptoelectronicsHuazhong University of Science and TechnologyWuhan China
Science China(Technological Sciences), 2010, 53 (03) : 800 - 806
[44] Study on localized induction heating for wafer level packaging
Xi YanYan
Luo XiaoBing
Liu WenMing
Chen MingXiang
Liu Sheng
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2010, 53 (03) : 800 - 806
[45] Study on localized induction heating for wafer level packaging
YanYan Xi
XiaoBing Luo
WenMing Liu
MingXiang Chen
Sheng Liu
Science China Technological Sciences, 2010, 53 : 800 - 806
[46] High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
C.-J. Lin
M.-T. Lin
S.-P. Wu
F.-G. Tseng
Microsystem Technologies, 2004, 10 : 517 - 521
[47] High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
Lin, CJ
Lin, MT
Wu, SP
Tseng, FG
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2004, 10 (6-7): : 517 - 521
[48] RESEARCH OF WAFER-LEVEL VACUUM PACKAGING BASED ON TGV TECHNOLOGY FOR MEMS DEVICES
Kuang, Yunbin
Hou, Zhanqiang
Zhuo, Ming
Xu, Qiang
Li, Qingsong
Xiao, Bin
Shan, Heng
Xiao, Dingbang
Wu, Xuezhong
2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020), 2020, : 988 - 991
[49] Modeling and Simulation of Cu TSV electroplating for wafer-level MEMS vacuum packaging
Shi, Shuai
Wang, Xuefang
Xu, Chunlin
Yuan, Jiaojiao
Fang, Jing
Jiang, Shengwei
Liu, Sheng
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 68 - 72
[50] Use of nanoporous columnar thin film in the wafer-level packaging of MEMS devices
Lee, Byung-Kee
Choi, Dong-Hoon
Yoon, Jun-Bo
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 20 (04)

← 1 2 3 4 5 →