共 40 条
- [31] Effects of plasma molding on feature profile of silicon micro-electro-mechanical systems through flux ion velocity distributions in two-frequency capacitively coupled plasma in SF6/O2 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (5A): : 3059 - 3065
- [33] Measurement of fluorocarbon radicals generated from C4F8/H2 inductively coupled plasma: study on SiO2 selective etching kinetics Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (4 B): : 2119 - 2124
- [35] RADIO-FREQUENCY PLASMA-ETCHING OF SI/SIO2 BY CL-2/O-2 - IMPROVEMENTS RESULTING FROM THE TIME MODULATION OF THE PROCESSING GASES JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1990, 8 (06): : 1185 - 1191
- [36] RADIO-FREQUENCY PLASMA-ETCHING OF SI/SIO2 BY CL2/O2 - IMPROVEMENTS RESULTING FROM THE TIME MODULATION OF THE PROCESSING GASES JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (03): : 816 - 819
- [37] MEASUREMENT OF FLUOROCARBON RADICALS GENERATED FROM C4F8/H-2 INDUCTIVELY-COUPLED PLASMA - STUDY ON SIO2 SELECTIVE ETCHING KINETICS JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (4B): : 2119 - 2124
- [38] Characteristics of SiO2 Etching by Capacitively Coupled Plasma with Different Fluorocarbon Liquids (C7F14, C7F8) and Fluorocarbon Gas (C4F8) APPLIED SCIENCE AND CONVERGENCE TECHNOLOGY, 2021, 30 (04): : 102 - 106