Time-resolved measurement of charging on hole bottoms of SiO2 wafer exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma

被引:9
|
作者
Ohmori, T
Goto, TK
Kitajima, T
Makabe, T
机构
[1] Keio Univ, Dept Elect & Elect Engn, Kohoku Ku, Yokohama, Kanagawa 2238522, Japan
[2] Natl Def Acad, Dept Elect Engn, Yokosuka, Kanagawa 2398686, Japan
关键词
pulsed; 2f-CCP; charging free process; charging in dielectric etching; emission CT; negative charge injection;
D O I
10.1143/JJAP.44.L1105
中图分类号
O59 [应用物理学];
学科分类号
摘要
We experimentally demonstrate a time chart of the shading either of electrons or positive ions on a topologically patterned wafer exposed to plasma etching by synchronized measurements of bottom-charging potential in a SiO, hole, current components incident on the wafer, and optical emission CT in the interface in a pulsed two frequency capacitively coupled plasma. The present paper gives a history of charging affected dynamically by an instantaneous electrical response on the bottom.
引用
收藏
页码:L1105 / L1108
页数:4
相关论文
共 40 条
  • [31] Effects of plasma molding on feature profile of silicon micro-electro-mechanical systems through flux ion velocity distributions in two-frequency capacitively coupled plasma in SF6/O2
    Hamaoka, Fukutaro
    Yagisawa, Takashi
    Makabe, Toshiaki
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (5A): : 3059 - 3065
  • [32] Numerical investigation of relationship between micro-scale pattern, interfacial plasma structure and feature profile during deep-Si etching in two-frequency capacitively coupled plasmas in SF6/O2
    Hamaoka, Fukutaro
    Yagisawa, Takashi
    Makabe, Toshiaki
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2009, 42 (07)
  • [33] Measurement of fluorocarbon radicals generated from C4F8/H2 inductively coupled plasma: study on SiO2 selective etching kinetics
    Kubota, Kazuhiro
    Matsumoto, Hiroyuki
    Shindo, Haruo
    Shingubara, Shoso
    Horiike, Yasuhiro
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (4 B): : 2119 - 2124
  • [34] Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Controlled
    Jeong, Wonnyoung
    Kim, Sijun
    Lee, Youngseok
    Cho, Chulhee
    Seong, Inho
    You, Yebin
    Choi, Minsu
    Lee, Jangjae
    Seol, Youbin
    You, Shinjae
    MATERIALS, 2023, 16 (10)
  • [35] RADIO-FREQUENCY PLASMA-ETCHING OF SI/SIO2 BY CL-2/O-2 - IMPROVEMENTS RESULTING FROM THE TIME MODULATION OF THE PROCESSING GASES
    MCNEVIN, SC
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1990, 8 (06): : 1185 - 1191
  • [36] RADIO-FREQUENCY PLASMA-ETCHING OF SI/SIO2 BY CL2/O2 - IMPROVEMENTS RESULTING FROM THE TIME MODULATION OF THE PROCESSING GASES
    MCNEVIN, SC
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (03): : 816 - 819
  • [37] MEASUREMENT OF FLUOROCARBON RADICALS GENERATED FROM C4F8/H-2 INDUCTIVELY-COUPLED PLASMA - STUDY ON SIO2 SELECTIVE ETCHING KINETICS
    KUBOTA, K
    MATSUMOTO, H
    SHINDO, H
    SHINGUBARA, S
    HORIIKE, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (4B): : 2119 - 2124
  • [38] Characteristics of SiO2 Etching by Capacitively Coupled Plasma with Different Fluorocarbon Liquids (C7F14, C7F8) and Fluorocarbon Gas (C4F8)
    Yoo, Seung-Wan
    Cho, Chulhee
    Kim, Kyungtae
    Lee, Hyochang
    You, Shinjae
    APPLIED SCIENCE AND CONVERGENCE TECHNOLOGY, 2021, 30 (04): : 102 - 106
  • [39] Mass spectroscopic measurement of time-varying ion composition in a pulse-modulated Ar/C4F8/O2 dual-frequency capacitively coupled plasma
    Kuboi, Shuichi
    Kato, Haruhito
    Seki, Yuto
    Suzuki, Haruka
    Toyoda, Hirotaka
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2023, 62 (SI)
  • [40] Study of optical emission spectroscopy using modified Boltzmann plot in dual-frequency synchronized pulsed capacitively coupled discharges with DC bias at low-pressure in Ar/O2/C4F8 plasma etching process
    Sahu, Bibhuti Bhusan
    Nakane, Kazuya
    Ishikawa, Kenji
    Sekine, Makoto
    Tsutsumi, Takayoshi
    Gohira, Taku
    Ohya, Yoshinobu
    Ohno, Noriyasu
    Hori, Masaru
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2022, 24 (22) : 13883 - 13896