Time-resolved measurement of charging on hole bottoms of SiO2 wafer exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma

被引:9
|
作者
Ohmori, T
Goto, TK
Kitajima, T
Makabe, T
机构
[1] Keio Univ, Dept Elect & Elect Engn, Kohoku Ku, Yokohama, Kanagawa 2238522, Japan
[2] Natl Def Acad, Dept Elect Engn, Yokosuka, Kanagawa 2398686, Japan
关键词
pulsed; 2f-CCP; charging free process; charging in dielectric etching; emission CT; negative charge injection;
D O I
10.1143/JJAP.44.L1105
中图分类号
O59 [应用物理学];
学科分类号
摘要
We experimentally demonstrate a time chart of the shading either of electrons or positive ions on a topologically patterned wafer exposed to plasma etching by synchronized measurements of bottom-charging potential in a SiO, hole, current components incident on the wafer, and optical emission CT in the interface in a pulsed two frequency capacitively coupled plasma. The present paper gives a history of charging affected dynamically by an instantaneous electrical response on the bottom.
引用
收藏
页码:L1105 / L1108
页数:4
相关论文
共 40 条
  • [21] MICROLOADING EFFECT IN HIGHLY SELECTIVE SIO2 CONTACT HOLE ETCHING EMPLOYING INDUCTIVELY-COUPLED PLASMA
    FUKASAWA, T
    KUBOTA, K
    SHINDO, H
    HORIIKE, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (12B): : 7042 - 7046
  • [22] 3D Etching profile evolution simulations: Time dependence analysis of the profile charging during SiO2 etching in plasma
    Radjenovic, Branislav
    Radmilovic-Radjenovic, Marija
    RADICALS AND NON-EQUILIBRIUM PROCESSES IN LOW-TEMPERATURE PLASMAS, 2007, 86
  • [23] Effects of mid-frequency power on SiO2 etching profile for fluorocarbon gas mixture in 100 MHz, 13.56 MHz, and 2 MHz triple-frequency capacitively coupled plasma
    Seo, Myeong Seok
    Park, Hyun Keun
    Shin, Jong Hyeon
    Hong, Sang Jeen
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2025, 64 (04)
  • [24] An in-situ time-resolved infrared spectroscopic study of silicon dioxide (SiO2) surface during selective etching over silicon in fluorocarbon plasma
    Ishikawa, K
    Sekine, M
    MICROPROCESSES AND NANOTECHNOLOGY 2000, DIGEST OF PAPERS, 2000, : 270 - 271
  • [25] Characterization of SiO2 Over Poly-Si Mask Etching in Ar/C4F8 Capacitively Coupled Plasma
    Seong, In Ho
    Lee, Jang Jae
    Cho, Chul Hee
    Lee, Yeong Seok
    Kim, Si Jun
    You, Shin Jae
    APPLIED SCIENCE AND CONVERGENCE TECHNOLOGY, 2021, 30 (06): : 176 - 182
  • [26] Characteristics of SiO2 etching by using pulse-time modulation in 60 MHz/2 MHz dual-frequency capacitive coupled plasma
    Jeon, M. H.
    Mishra, A. K.
    Kang, S. -K.
    Kim, K. N.
    Kim, I. J.
    Lee, S. B.
    Sin, T. H.
    Yeom, G. Y.
    CURRENT APPLIED PHYSICS, 2013, 13 (08) : 1830 - 1836
  • [27] Sub-45 nm SiO2 Etching with Stacked-Mask Process Using High-Bias-Frequency Dual-Frequency-Superimposed RF Capacitively Coupled Plasma
    Kikutani, Keisuke
    Ohashi, Takashi
    Kojima, Akihiro
    Sakai, Itsuko
    Abe, Junko
    Hayashi, Hisataka
    Ui, Akio
    Ohiwa, Tokuhisa
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (10) : 8026 - 8029
  • [28] Optical diagnostics for plasma-surface interaction in CF4/Ar radio-frequency inductively coupled plasma during Si and SiO2 etching
    Miyoshi, Y.
    Miyauchi, M.
    Oguni, A.
    Makabe, T.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2006, 24 (05): : 1718 - 1724
  • [29] Real-Time Endpoint Detection of Small Exposed Area SiO2 Films in Plasma Etching Using Plasma Impedance Monitoring with Modified Principal Component Analysis
    Jang, Haegyu
    Nam, Jaewook
    Kim, Chang-Koo
    Chae, Heeyeop
    PLASMA PROCESSES AND POLYMERS, 2013, 10 (10) : 850 - 856
  • [30] Highly Selective Etching of SiO2 over Si3N4 and Si in Capacitively Coupled Plasma Employing C5HF7 Gas
    Miyawaki, Yudai
    Kondo, Yusuke
    Sekine, Makoto
    Ishikawa, Kenji
    Hayashi, Toshio
    Takeda, Keigo
    Kondo, Hiroki
    Yamazaki, Atsuyo
    Ito, Azumi
    Matsumoto, Hirokazu
    Hori, Masaru
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2013, 52 (01)