共 50 条
- [1] Effects of bias frequency on reactive ion etching lag in an electron cyclotron resonance plasma etching system JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1997, 15 (03): : 664 - 667
- [3] COMPARISON OF DAMAGE IN THE DRY ETCHING OF GAAS BY CONVENTIONAL REACTIVE ION ETCHING AND BY REACTIVE ION ETCHING WITH AN ELECTRON-CYCLOTRON RESONANCE GENERATED PLASMA JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1989, 7 (06): : 1462 - 1466
- [4] Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (1A): : 50 - 55
- [5] REACTIVE ION ETCHING LAG INVESTIGATION OF OXIDE ETCHING IN FLUOROCARBON ELECTRON-CYCLOTRON-RESONANCE PLASMAS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (04): : 1957 - 1961
- [6] Effect of N2 addition on aluminum alloy etching by electron cyclotron resonance reactive ion etching and magnetically enhanced reactive ion etching Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (4 B): : 2147 - 2151
- [7] EFFECTS OF ETCH CHEMISTRY ON SF6-BASED TUNGSTEN ETCHING BY ELECTRON-CYCLOTRON-RESONANCE REACTIVE ION ETCHING JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06): : 3351 - 3355
- [8] Mechanism of reactive ion etching lag in WSi2 etching using electron cyclotron resonance plasma Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1994, 33 (4 B): : 2170 - 2174
- [9] EFFECT OF N-2 ADDITION ON ALUMINUM-ALLOY ETCHING BY ELECTRON-CYCLOTRON-RESONANCE REACTIVE ION ETCHING AND MAGNETICALLY ENHANCED REACTIVE ION ETCHING JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (4B): : 2147 - 2151