Ternary lead-free SnAgCu micro-bumps for ultra-fine pitch chip-to-chip interconnection

被引：0

作者：

Tsai, Tsung-Fu ^{[1
]}

Chang, Jing-Yao ^{[1
]}

Chien, Chien-Wei ^{[1
]}

Juang, Jing-Ye ^{[1
]}

Shen, Li-Cheng ^{[1
]}

机构：

[1] Ind Technol Res Inst, Elect & Optoelect Res Labs, Hsinchu 310, Taiwan

来源：

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS | 2008年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Immersion solder bumping, a mask-less and low cost processing, brings feasibility to the ultra-fine pitch chip-to-chip interconnection; however, how to make the uniform micro-bump is still a great challenge. In this paper, the uniform micro-bumps with very thin Sn-3.0Ag-0.5Cu (SAC305) solder layer on electroless nickel under bump metallization (UBM) are achieved. The test chips we used have 6,507 SAC305 solder micro-bumps with a pitch of 30um. Two test chips are bonded to each other, and the optimum bonding conditions for a sufficient bonding quality are determined. The interfacial microstructure of the bonded samples before and after aging at 150 degrees C for 168 hours is also investigated. The present results shows that the rapid phase growth at the solder/UBM interface would have a great impact on solder joint reliability.

引用

页码：54 / 58

页数：5

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