Ternary lead-free SnAgCu micro-bumps for ultra-fine pitch chip-to-chip interconnection

被引：0
|
作者：
Tsai, Tsung-Fu [1 ]
Chang, Jing-Yao [1 ]
Chien, Chien-Wei [1 ]
Juang, Jing-Ye [1 ]
Shen, Li-Cheng [1 ]
机构：
[1] Ind Technol Res Inst, Elect & Optoelect Res Labs, Hsinchu 310, Taiwan
来源：
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS | 2008年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Immersion solder bumping, a mask-less and low cost processing, brings feasibility to the ultra-fine pitch chip-to-chip interconnection; however, how to make the uniform micro-bump is still a great challenge. In this paper, the uniform micro-bumps with very thin Sn-3.0Ag-0.5Cu (SAC305) solder layer on electroless nickel under bump metallization (UBM) are achieved. The test chips we used have 6,507 SAC305 solder micro-bumps with a pitch of 30um. Two test chips are bonded to each other, and the optimum bonding conditions for a sufficient bonding quality are determined. The interfacial microstructure of the bonded samples before and after aging at 150 degrees C for 168 hours is also investigated. The present results shows that the rapid phase growth at the solder/UBM interface would have a great impact on solder joint reliability.
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页码：54 / 58
页数：5
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