共 50 条
- [32] High-Speed Low-Current Duobinary Signaling Over Active Terminated Chip-to-Chip Interconnect 2009 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, 2009, : 73 - 78
- [34] A Study on High-density High-speed SerDes Design in Buildup Flip Chip Ball Grid Array Packages 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 248 - 251
- [35] A REGENERATOR CHIP SET FOR HIGH-SPEED DIGITAL TRANSMISSION IEEE INTERNATIONAL SOLID STATE CIRCUITS CONFERENCE, 1984, 27 : 240 - +
- [36] A simple and fast tool for the modelling of inter-symbol interference and equalization in high-speed chip-to-chip interfaces 2019 42ND INTERNATIONAL CONVENTION ON INFORMATION AND COMMUNICATION TECHNOLOGY, ELECTRONICS AND MICROELECTRONICS (MIPRO), 2019, : 112 - 116
- [37] A LOW-MASS HIGH-SPEED μGC SEPARATION COLUMN WITH BUILT-IN FLUIDIC CHIP-TO-CHIP INTERCONNECTS 2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2011, : 813 - 816
- [38] Packaging of a high-speed optical modulator using flip chip interconnects 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 212 - 218
- [39] CTLE Adaptation Using Deep Learning in High-speed SerDes Link 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 952 - 955
- [40] High-speed circuits employing on-chip magnetic components 1999 SOUTHWEST SYMPOSIUM ON MIXED-SIGNAL DESIGN, SSMSD 99, 1999, : 156 - 161