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- [21] Electrical and Morphological Characterization for High Integrated Silicon Interposer and Technology Transfer from 200 mm to 300mm Wafer 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 334 - 341
- [23] A common APC architecture for 200 & 300mm etch DESIGN, PROCESS INTEGRATION, AND CHARACTERIZATION FOR MICROELECTRONICS, 2002, 4692 : 155 - 161
- [24] Plasma doping system for 200 and 300mm wafers 2000 INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY, PROCEEDINGS, 2000, : 472 - 475
- [25] Wafer Geometry Technique for Blank 300mm Silicon Wafers 2022 33RD ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2022,
- [27] Development of flash lamp annealing system for 300mm wafer 2003 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2003, : 153 - 156
- [28] Setting performance targets in a 300mm wafer fabrication facility ASCMC 2003: IEEE/SEMI (R) ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, PROCEEDINGS, 2003, : 75 - 79
- [29] Investigations of 300mm wafer tool set progress and performance PLASMA PROCESSING XIV, 2002, 2002 (17): : 125 - 136