Nanoscale electrical characterization of HfO2/SiO2 MOS gate stacks with enhanced -: CAFM

被引:0
|
作者
Nafría, J [1 ]
Blasco, X [1 ]
Porti, M [1 ]
Aguilera, L [1 ]
Aymerich, X [1 ]
Petry, J [1 ]
Vandervorst, W [1 ]
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, E-08193 Bellaterra, Spain
来源
2005 SPANISH CONFERENCE ON ELECTRON DEVICES, PROCEEDINGS | 2005年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The conduction and dielectric breakdown (BD) of an ultra-thin HfO2/SiO2 gate stack is studied at the nanoscale. With this purpose, an Enhanced Conductive Atomic Force Microscope (a CAFM with extended electrical performance) has been developed. Using this new set up, different conduction modes have been observed before BD, which can be masked during standard tests. The study of the BD spots has revealed that, as for SiO2, the BD of the stack leads to modifications in the topography images and high conductive spots in the current images.
引用
收藏
页码:65 / 68
页数:4
相关论文
共 50 条
  • [21] Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO2 and HfO2/SiO2 gate dielectric stacks
    Samanta, Piyas
    Zhu, Chunxiang
    Chan, Mansun
    MICROELECTRONICS RELIABILITY, 2010, 50 (12) : 1907 - 1914
  • [22] TiN/HfO2/SiO2/Si gate stack breakdown:: Contribution of HfO2 and interfacial SiO2 layer
    Rahim, N.
    Misra, D.
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (10) : G194 - G198
  • [23] Electrical stress-induced charge carrier generation/trapping related degradation of HfAlO/SiO2 and HfO2/SiO2 gate dielectric stacks
    Samanta, Piyas
    Cheng, Chin-Lung
    Lee, Yao-Jen
    Chan, Mansun
    JOURNAL OF APPLIED PHYSICS, 2009, 105 (12)
  • [24] Effect of the post-deposition annealing on electrical characteristics of MIS structures with HfO2/SiO2 gate dielectric stacks
    Taube, Andrzej
    Mroczynski, Robert
    Korwin-Mikke, Katarzyna
    Gieraltowska, Sylwia
    Szmidt, Jan
    Piotrowska, Anna
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2012, 177 (15): : 1281 - 1285
  • [25] The influence of Coulomb centers located in HfO2/SiO2 gate stacks on the effective electron mobility
    Barraud, Sylvain
    Bonno, Olivier
    Casse, Mikael
    JOURNAL OF APPLIED PHYSICS, 2008, 104 (07)
  • [26] Investigation of SiO2/HfO2 gate stacks for application to non-volatile memory devices
    Buckley, J
    De Salvo, B
    Ghibaudo, G
    Gely, M
    Damlencourt, JF
    Martin, F
    Nicotra, G
    Deleonibus, S
    SOLID-STATE ELECTRONICS, 2005, 49 (11) : 1833 - 1840
  • [27] Band alignment issues related to HfO2/SiO2/p-Si gate stacks
    Sayan, S
    Emge, T
    Garfunkel, E
    Zhao, XY
    Wielunski, L
    Bartynski, RA
    Vanderbilt, D
    Suehle, JS
    Suzer, S
    Banaszak-Holl, M
    JOURNAL OF APPLIED PHYSICS, 2004, 96 (12) : 7485 - 7491
  • [28] Comparison of plasma-induced damage in SiO2/TiN and HfO2/TiN gate stacks
    Young, C. D.
    Bersuker, G.
    Zhu, F.
    Matthews, K.
    Choi, R.
    Song, S. C.
    Park, H. K.
    Lee, J. C.
    Lee, B. H.
    2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, : 67 - +
  • [29] Effect of the interfacial SiO2 layer in high-k HfO2 gate stacks on NBTI
    Neugroschel, Arnost
    Bersuker, Gennadi
    Choi, Rino
    Lee, Byoung Hun
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2008, 8 (01) : 47 - 61
  • [30] Investigation of atomic vapour deposited TiN/HfO2/SiO2 gate stacks for MOSIFET devices
    Wenger, Ch.
    Lukosius, M.
    Costina, I.
    Sorge, R.
    Dabrowski, J.
    Muessig, H.-J.
    Pasko, S.
    Lohe, Ch.
    MICROELECTRONIC ENGINEERING, 2008, 85 (08) : 1762 - 1765