Approximate Pattern Matching for On-Chip Interconnect Traffic Prediction

被引:0
|
作者
Adhinarayanan, Vignesh [1 ]
Feng, Wu-chun [1 ]
机构
[1] Virginia Tech, Blacksburg, VA 24061 USA
来源
PACT '20: PROCEEDINGS OF THE ACM INTERNATIONAL CONFERENCE ON PARALLEL ARCHITECTURES AND COMPILATION TECHNIQUES | 2020年
关键词
D O I
10.1145/3410463.3414667
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Emerging multi-chip module GPUs (MCM-GPUs) expend over 17% of the total power budget on chip interconnects and this fraction is expected to increase as chip size increases. Towards proactively managing the power consumption of these interconnects, we propose approximate pattern matching to predict future interconnect traffic from past observations. Compared to past prediction techniques such as Markov model (MM) and history table (HT), our proposed technique reduces average prediction error to 2.66% from 7.11% and 3.83% for MM and HT, respectively.
引用
收藏
页码:357 / 358
页数:2
相关论文
共 50 条
  • [21] On-chip optical interconnect using visible light
    Wei Cai
    Bing-cheng Zhu
    Xu-min Gao
    Yong-chao Yang
    Jia-lei Yuan
    Gui-xia Zhu
    Yong-jin Wang
    Peter Grünberg
    Frontiers of Information Technology & Electronic Engineering, 2017, 18 : 1288 - 1294
  • [22] The Y architecture for on-chip interconnect: Analysis and methodology
    Chen, HY
    Cheng, CK
    Kahng, AB
    Mandoiu, II
    Wang, QK
    Yao, B
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2005, 24 (04) : 588 - 599
  • [23] Well-behaved global on-chip interconnect
    Caputa, P
    Svensson, C
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2005, 52 (02) : 318 - 323
  • [24] On-chip optical interconnect using visible light
    Cai, Wei
    Zhu, Bing-cheng
    Gao, Xu-min
    Yang, Yong-chao
    Yuan, Jia-lei
    Zhu, Gui-xia
    Wang, Yong-jin
    Grunberg, Peter
    FRONTIERS OF INFORMATION TECHNOLOGY & ELECTRONIC ENGINEERING, 2017, 18 (09) : 1288 - 1294
  • [25] Materials and devices for silicon on-chip optical interconnect
    Ballantyne, JM
    ADVANCED INTERCONNECTS AND CONTACT MATERIALS AND PROCESSES FOR FUTURE INTEGRATED CIRCUITS, 1998, 514 : 83 - 87
  • [26] On-chip interconnect inductance - Friend or foe (invited)
    Wong, SS
    Yue, P
    Chang, R
    Kim, SY
    Kleveland, B
    O'Mahony, F
    4TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, PROCEEDINGS, 2003, : 389 - 394
  • [27] Layout techniques for on-chip interconnect inductance reduction
    Tu, SW
    Jou, JY
    Chang, YW
    ASP-DAC 2004: PROCEEDINGS OF THE ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, 2004, : 269 - 273
  • [28] On-chip optical interconnect on silicon by transfer printing
    Liu, Lei
    Loi, Ruggero
    Roycroft, Brendan
    O'Callaghan, James
    Justice, John
    Trindade, Antonio Jose
    Kelleher, Ste En
    Gocalinska, Agnieszka
    Thomas, Kevin
    Pelucchi, Emanuele
    Bower, Christopher A.
    Corbett, Brian
    2018 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2018,
  • [29] Leakage-aware interconnect for on-chip network
    Tsai, YF
    Narayaynan, V
    Xie, Y
    Irwin, MJ
    DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION, VOLS 1 AND 2, PROCEEDINGS, 2005, : 230 - 231
  • [30] GaN directional couplers for on-chip optical interconnect
    Yuan, Jialei
    Gao, Xumin
    Yang, Yongchao
    Zhu, Guixia
    Yuan, Wei
    Choi, Hoi Wai
    Zhang, Zhiyu
    Wang, Yongjin
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2017, 32 (04)