A 300mm semiconductor manufacturing foreign material reduction initiative

被引：0

作者：

Long, Christopher W. ^{[1
]}

Sienkiewicz, Thomas ^{[2
]}

机构：

[1] IBM Syst & Technol Grp, 1000 River St, Essex Jct, VT 05452 USA

[2] IBM Syst & Technol Grp, Fishkill, NY 12533 USA

来源：

2007 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE | 2007年

关键词：

foreign material; tool defect controls; yield enhancement; variability reduction; monitor wafer;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the strategy and subsequent results of a multifaceted effort to reduce FM impact during the ramp up of the IBM 300mm semiconductor manufacturing facility in Hope-well Junction, NY.

引用

页码：220 / +

页数：2

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