Residual layer-free Reverse Nanoimprint Lithography on silicon and metal-coated substrates

被引：16

作者：

Fernandez, Ariadna ^{[1
]}

Medina, Juan ^{[1
]}

Benkel, Christian ^{[2
]}

Guttmann, Markus ^{[2
]}

Bilenberg, Brian ^{[3
]}

Thamdrup, Lasse H. ^{[3
]}

Nielsen, Theodor ^{[3
]}

Sotomayor Torres, Clivia M. ^{[1
,4
]}

Kehagias, Nikolaos ^{[1
]}

机构：

[1] Catalan Inst Nanosci & Nanotechnol, Barcelona 08193, Spain

[2] KIT, Inst Microstruct Technol, D-76344 Eggenstein Leopoldshafen, Germany

[3] NIL Technol ApS, DK-2800 Lyngby, Denmark

[4] ICREA, Barcelona 08010, Spain

来源：

MICROELECTRONIC ENGINEERING | 2015年 / 141卷

关键词：

Nanoimprint Lithography; Injection molding; Functional surfaces; WENZEL WETTING TRANSITION; IMPRINT LITHOGRAPHY; POLYMER; SURFACES; ENERGY;

D O I：

10.1016/j.mee.2014.11.025

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work we demonstrate-that Reverse Nanoimprint Lithography is a feasible and flexible lithography technique applicable to the transfer of micro and nano polymer structures with no residual layer over areas of cm(2) areas on silicon, metal and non-planar substrates. We used a flexible polydimethylsiloxane stamp with hydrophobic features. We present residual layer-free patterns imprinted using a commercial poly(methylmethacrylate) thermoplastic polymer over silicon, nickel and pre-patterned substrates. Our versatile patterning technology is adaptable to free form nano structuring and has coupling to adhesion technologies. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：56 / 61

页数：6

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