Steady state thermal analysis of a reconfigurable wafer-scale circuit board

被引：0

作者：

Bougataya, Mohammed ^{[1
,2
]}

Lakhsasi, Ahmed ^{[2
]}

Norman, Richard

Prytula, Richard ^{[3
]}

Blaquiere, Yves ^{[4
,5
]}

Savaria, Yvon

机构：

[1] Univ Quebec Trois Rivieres, Trois Rivieres, PQ GA9 5H7, Canada

[2] Univ Quebec, Outaouais, PQ, Canada

[3] Gesti TechnoCap Inc, Montreal, PQ, Canada

[4] Univ Quebec, Montreal, PQ, Canada

[5] Ecole Polytech Montreal, Montreal, PQ, Canada

来源：

2008 CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING, VOLS 1-4 | 2008年

基金：

加拿大自然科学与工程研究理事会;

关键词：

thermal analysis; heat transfer; junction temperature; VLSI; finite element;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

During the development of a reconfigurable wafer-scale circuit board, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing the capabilities of the WaferBoard (TM) technology. This paper presents a thermal analysis of that technology. For this study, various thermal boundary conditions are analyzed and thermal profiles with 3D thermal contours are presented. 3D finite element thermal models are used to predict local thermal peaks on the WaferBoard (TM) structure. This model allows exploring the possibilities to minimize the thermal gradient in the critical areas, especially at the solder balls level. In a second step, thermal stress analysis will be conducted using the temperature loads calculated by steady state thermal analysis.

引用

页码：394 / +

页数：2

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