Design Optimization for Electrical Performance of a LFBGA Package Using EM-field Simulation

被引：0
|
作者：
Hunat, Christopher [1 ]
Tubillo, Carolyn [1 ]
Wang, Chuen Khiang [1 ]
Liang, Ren [1 ]
Suthiwongsunthorn, Nathapong [1 ]
机构：
[1] United Test & Assembly Ctr Ltd, Singapore 554916, Singapore
来源：
PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2012年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：770 / 773
页数：4
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