Design Optimization for Electrical Performance of a LFBGA Package Using EM-field Simulation

被引：0
|
作者：
Hunat, Christopher [1 ]
Tubillo, Carolyn [1 ]
Wang, Chuen Khiang [1 ]
Liang, Ren [1 ]
Suthiwongsunthorn, Nathapong [1 ]
机构：
[1] United Test & Assembly Ctr Ltd, Singapore 554916, Singapore
来源：
PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：770 / 773
页数：4
相关论文
共 50 条
  • [41] Performance simulation and design optimization of superluminescent emitting diodes
    Park, J
    Kawakami, Y
    Li, X
    Huang, WP
    NUSOD '05: Proceedings of the 5th International Conference on Numerical Simulations of Optoelectronic Devices, 2004, : 117 - 118
  • [42] Simulation and Robust Optimization Design for Electromagnetic Railgun Performance
    Shang, Xiaobing
    Chao, Tao
    Ma, Ping
    Yang, Ming
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2019, 47 (06) : 2964 - 2970
  • [43] Design optimization using Subset Simulation algorithm
    Li, Hong-Shuang
    Au, Siu-Kiu
    STRUCTURAL SAFETY, 2010, 32 (06) : 384 - 392
  • [44] EBGA: High frequency electrical characterization and the influence of substrate design parameters on package performance
    Qiu, Youlin
    Iyer, Mahadevan K.
    Chong, Kok Chin
    Zhang, Tong Long
    Rasiah, Ignasius
    Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 107 - 111
  • [45] Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
    Hsieh, Tsun-Lung
    Kuo, Hung-Chun
    Jhong, Ming-Fong
    Huang, Chih-Yi
    Wang, Chen-Chao
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 457 - 460
  • [46] Application of Qualitative Imaging Methods to Electrical Performance-Aware Package Board Design
    Ambasana, Nikita
    Gope, Dipanjan
    Chandrasekhar, Arun
    2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2013, : 247 - 250
  • [47] EBGA: High frequency electrical characterization and the influence of substrate design parameters on package performance
    Qiu, Y
    Iyer, MK
    Chong, KC
    Zhang, TL
    Rasiah, I
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 107 - 111
  • [48] Increasing the performance of crab linux router simulation package using XEN
    Abbas, Haider
    Sundkvist, Stefan
    2006 International Conference on Industrial and Information Systems, Vols 1 and 2, 2006, : 459 - 462
  • [49] Taper Pad Design to Improve Electrical Performance of BGAs on Wafer Level Package (WLP)
    Tsai, Chung-Hao
    Yeh, Vincent
    Wang, Chuei-Tang
    Yu, Doug
    2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 29 - 32
  • [50] On the optimization of the number of elements of MMIC low pass filter using EM simulation
    Sulaiman, AA
    Awang, Z
    2004 RF AND MICROWAVE CONFERENCE, RFM 2004, PROCEEDINGS, 2004, : 56 - 59
12345