Optimization of stacked die design on stacked die QFN package by simulation approach

In semiconductor industry, the technology of stacking dies into a package become popular without much consideration of potential reliability issues. However, Finite Element Method has been introduced to semiconductor industry to minimize the experimental cost and times. In this paper, Finite Element Method and statistical analyses are used to optimize the design parameter of stacked die. Birth and death element options are used to determine the die shear stress for manufacturing process. The die shear stress results after the fully processes are used for statistical analysis. Six factors are used in this study to identify the optimal design. It is suggested that, numerical simulation combining with Taguchi Method statistical analyses can be useful tool for optimization of stacked die design parameter.