Bonding Wire Fatigue Life Prediction of Power Module in Thermal Cycling Test

被引：0
|
作者：
Guo, Yuanqi [1 ]
Xu, Yangjian [1 ]
Liang, Lihua [1 ]
Liu, Yong [2 ]
机构：
[1] Zhejiang Univ Technol, Coll Mech Engn, Hangzhou, Zhejiang, Peoples R China
[2] Fairchild Semicond, Portland, ME USA
来源：
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年
关键词：
wire bonding; thermal cycling test; finite element simulation;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, 3-D finite element (FE) models were established to investigate the fatigue lives of bonding wire in different power packages in thermal cycling test. Meanwhile, three types of packages were tested. Bonding wire lift-off and neck failures took place during test, which were caused by the coefficient of thermal expansion (CTE) mismatch between wire and chip. Finally, a strain-based life prediction relation for thermal cycling test was proposed by combining the experiment results with simulation data.
引用
收藏
页码：482 / 485
页数：4
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