The effect of Co incorporation on electrical characteristics of n+/p shallow junction formed by dopant implantation into CoSi2 and anneal

被引:10
|
作者
Park, JS [1 ]
Sohn, DK
Bae, JU
Han, CH
Park, JW
机构
[1] Hyundai Micro Elect Co Ltd, R&D Div, Cheongju 361725, South Korea
[2] Elect & Telecommun Res Inst, Basic Res Lab, Taejon 305600, South Korea
关键词
Co traps; generation current; Poole-Frenkel barrier lowering; silicided junction;
D O I
10.1109/16.841231
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The impact of Co incorporation on the electrical characteristics has been investigated in n(+)/p junction formed by dopant implantation into CoSi2 and drive-in anneal, The junctions were formed by As+ (30 or 40 keV, 1 x 10(16) cm(-2)) implantation into 35 nm-thick CoSi2 followed by drive-in annealing at 900 degrees C for 30 s in an N-2 ambient. Deeper junction implanted by As+ at 40 keV was not influenced by the Co incorporation. However, for shallower junction implanted by As+ at 30 keV, incorporation of Co atoms increased its leakage current, which were supposed to be dissociated from the CoSi2 layer by silicide agglomeration during annealing, The mechanism of such a high leakage current was found to be Poole-Frenkel barrier lowering induced by high density of Co traps.
引用
收藏
页码:994 / 998
页数:5
相关论文
共 50 条
  • [11] Systematic investigation of leakage suppression by pre-silicide implantation for CoSi2 formation on shallow n+/p Si diodes
    Tsuchiaki, Masakatsu
    Murakoshi, Atsushi
    Hongo, Chie
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2003, 42 (4 B): : 1847 - 1854
  • [12] Effects of dopant deposition on p+/n and n+/p shallow junctions formed by plasma immersion ion implantation
    Bernstein, JD
    Kellerman, PL
    Bradley, MP
    2000 INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY, PROCEEDINGS, 2000, : 464 - 467
  • [13] Electronic characteristics of P-Si CoSi2/Si Schottky junction formed by high flux metal ion implantation
    Li, Ying
    Wang, Yuhua
    Wang, Yan
    Tian, Lilin
    Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics, 2005, 25 (01): : 98 - 101
  • [14] THE REVERSE ANNEAL OF JUNCTION CHARACTERISTICS IN FORMING SHALLOW P+-N JUNCTION BY BF-2(+) IMPLANTATION INTO THIN CO FILMS ON SI SUBSTRATE
    JUANG, MH
    CHENG, HC
    IEEE ELECTRON DEVICE LETTERS, 1992, 13 (04) : 220 - 222
  • [15] SINGLE CRYSTALLINE COSI2 LAYERS FORMED BY CO IMPLANTATION INTO SI
    VANOMMEN, AH
    OTTENHEIM, JJM
    BULLELIEUWMA, CWT
    THEUNISSEN, AML
    APPLIED SURFACE SCIENCE, 1989, 38 (1-4) : 197 - 206
  • [16] COMPARISON BETWEEN COSI2 AND TISI2 AS DOPANT SOURCE FOR SHALLOW SILICIDED JUNCTION FORMATION
    VANDENHOVE, L
    MAEX, K
    HOBBS, L
    LIPPENS, P
    DEKEERSMAECKER, R
    PROBST, V
    SCHABER, H
    APPLIED SURFACE SCIENCE, 1989, 38 (1-4) : 430 - 440
  • [17] Elevated n+/p junctions by implant into CoSi2 formed on selective epitaxy for deep submicron MOSFET's
    AMD, Inc, Sunnyvale, United States
    IEEE Trans Electron Devices, 9 (1946-1952):
  • [18] Elevated n+/p junctions by implant into CoSi2 formed on selective epitaxy for deep submicron MOSFET's
    Sun, JJ
    Tsai, JY
    Osburn, CM
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (09) : 1946 - 1952
  • [19] Shallow junction formed by COSi2 as a diffusion source with phosphorus add-ion implantation for 0.15-μm CMOS technology
    Jang, MJ
    Lee, JH
    Park, YJ
    Yoon, HK
    Lee, HD
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2002, 40 (04) : 619 - 623
  • [20] Electrical characterization of ultra-shallow junctions formed by diffusion from a CoSi2 layer
    LaVia, F
    Rimini, E
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (04) : 526 - 534