Effects of Oxide Species on the Reduction of Contact Resistivity of Al/oxide/n-GaN MIS Devices

被引:0
|
作者
Koba, Jiro [1 ,2 ]
Koike, Junichi [1 ]
机构
[1] Tohoku Univ, Dept Mat Sci, Sendai, Miyagi 9808572, Japan
[2] JX Nippon Min & Met Corp, Tokyo 1058417, Japan
来源
2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM | 2023年
关键词
GaN; MIS contact; MIGS;
D O I
10.1109/EDTM55494.2023.10102978
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We investigated metal-insulator-semiconductor (MIS) contact using GaOx, TiOx, and ZnOx on nGaN having Si doping concentration of 2 x 10(18) cm(-3). While we obtained the low specific contact resistivity (rho c) of 7.1 x 10(-7) Omega center dot cm(2) with GaOx and 7.7 x 10(-5) Omega center dot cm(2) with TiOx, rho c increased with ZnOx. We further evaluated the band alignment of oxide/GaN and discussed the variation of the Schottky barrier height (SBH) based on the metalinduced gap states (MIGS) model to validate our results.
引用
收藏
页数:3
相关论文
共 50 条
  • [41] Formation of thin native oxide layer on n-GaN by electrochemical process in mixed solution with glycol and water
    Shiozaki, Nanako
    Sato, Taketomo
    Hashizume, Tamotsu
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (4A): : 1471 - 1473
  • [42] Hydrogen gas generation using n-GaN photoelectrodes with immersed Indium Tin Oxide ohmic contacts
    Liu, Shu-Yen
    Lin, Yu-Chuan
    Ye, Jhao-Cheng
    Tu, S. J.
    Huang, F. W.
    Lee, M. L.
    Lai, W. C.
    Sheu, J. K.
    OPTICS EXPRESS, 2011, 19 (23): : A1196 - A1201
  • [43] Achieving Ultralow Specific Contact Resistivity in Ti/n+-GaN Ohmic Contacts by Mitigating the FLP Effect with a Gallium Oxide Interlayer
    Xie, Shujie
    He, Jiaheng
    Wu, Xuankun
    Cheng, Zhe
    Zhang, Lian
    Mi, Changxin
    Xie, Qiao
    Zhang, Yun
    ACS APPLIED ELECTRONIC MATERIALS, 2025, 7 (07) : 2709 - 2719
  • [44] Reduction of operation voltage in GaN-based light-emitting diode utilizing a Si δ-doped n-GaN contact layer
    Jeon, Seong-Ran
    Cho, Myong Soo
    Hung, Tran Vinh
    Yu, Min-A.
    Yang, Gye Mo
    Japanese Journal of Applied Physics, Part 2: Letters, 2002, 41 (7 A):
  • [45] Formation of thin native oxide layer on n-GaN by electrochemical process in mixed solution with glycol and water
    Shiozaki, Nanako
    Sato, Taketomo
    Hashizume, Tamotsu
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2007, 46 (4 A): : 1471 - 1473
  • [46] Reduction of operation voltage in GaN-based light-emitting diode utilizing a Si δ-doped n-GaN contact layer
    Jeon, SR
    Cho, MS
    Hung, TV
    Yu, MA
    Yang, GM
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2002, 41 (7A): : L761 - L764
  • [47] Ohmic contact formation of Ti/Al/Ni/Au to n-GaN by two-step annealing method
    Chen, ZZ
    Qin, ZX
    Hu, CY
    Hu, XD
    Yu, TJ
    Tong, YZ
    Ding, XM
    Zhang, GY
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2004, 111 (01): : 36 - 39
  • [48] Structural, Chemical and Electrical Properties of Au/La2O3/n-GaN MIS Junction with a High-k Lanthanum Oxide Insulating Layer
    Uma, M.
    Balaram, N.
    Reddy, P. R. Sekhar
    Janardhanam, V.
    Reddy, V. Rajagopal
    Yun, Hyung-Joong
    Lee, Sung-Nam
    Choi, Chel-Jong
    JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (07) : 4217 - 4225
  • [49] Structural, Chemical and Electrical Properties of Au/La2O3/n-GaN MIS Junction with a High-k Lanthanum Oxide Insulating Layer
    M. Uma
    N. Balaram
    P. R. Sekhar Reddy
    V. Janardhanam
    V. Rajagopal Reddy
    Hyung-Joong Yun
    Sung-Nam Lee
    Chel-Jong Choi
    Journal of Electronic Materials, 2019, 48 : 4217 - 4225
  • [50] Differences in the reaction kinetics and contact formation mechanisms of annealed Ti/Al/Mo/Au Ohmic contacts on n-GaN and AlGaN/GaN epilayers
    Wang, Liang
    Mohammed, Fitih M.
    Adesida, Ilesanmi
    JOURNAL OF APPLIED PHYSICS, 2007, 101 (01)