Effects of Oxide Species on the Reduction of Contact Resistivity of Al/oxide/n-GaN MIS Devices

被引:0
|
作者
Koba, Jiro [1 ,2 ]
Koike, Junichi [1 ]
机构
[1] Tohoku Univ, Dept Mat Sci, Sendai, Miyagi 9808572, Japan
[2] JX Nippon Min & Met Corp, Tokyo 1058417, Japan
来源
2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM | 2023年
关键词
GaN; MIS contact; MIGS;
D O I
10.1109/EDTM55494.2023.10102978
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We investigated metal-insulator-semiconductor (MIS) contact using GaOx, TiOx, and ZnOx on nGaN having Si doping concentration of 2 x 10(18) cm(-3). While we obtained the low specific contact resistivity (rho c) of 7.1 x 10(-7) Omega center dot cm(2) with GaOx and 7.7 x 10(-5) Omega center dot cm(2) with TiOx, rho c increased with ZnOx. We further evaluated the band alignment of oxide/GaN and discussed the variation of the Schottky barrier height (SBH) based on the metalinduced gap states (MIGS) model to validate our results.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] Low-resistance Ti/Al/Ti/Au multilayer ohmic contact to n-GaN
    Wang, DF
    Feng, SW
    Lu, C
    Motayed, A
    Jah, M
    Mohammad, SN
    Jones, KA
    Salamanca-Riba, L
    JOURNAL OF APPLIED PHYSICS, 2001, 89 (11) : 6214 - 6217
  • [32] Electrical properties and thermal stability of Ti/Al ohmic contact on n-GaN Schottky diode
    Munir, Tariq
    Aziz, Azlan Abdul
    Abdullah, Mat Johar
    JURNAL FIZIK MALAYSIA, 2008, 29 (1-2): : 41 - 45
  • [33] Effect of microwave radiation on I-V curves and contact resistivity of ohmic contacts to n-GaN and n-AIN
    Belyaev, A. E.
    Boltovets, N. S.
    Zhilyaev, Yu. V.
    Zhigunov, V. S.
    Konakova, R. V.
    Panteleev, V. N.
    Sachenko, A. V.
    Sheremet, V. N.
    SEMICONDUCTOR PHYSICS QUANTUM ELECTRONICS & OPTOELECTRONICS, 2013, 16 (03) : 289 - 292
  • [34] Insight into the Al/N-GaN barrier property to realize high quality n-type Ohmic contact
    Wang, Ting
    Xiong, Zhihua
    Zhao, Juanli
    Wu, Ning
    Du, Kun
    Zhou, Mingbin
    Ao, Lei
    JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 818 (818)
  • [35] Proposal of oxide-formed two-step wet etching process for n-GaN
    Kiyoto, Yasuharu
    Makie, Tetsuo
    Fujioka, Hiroshi
    Maeda, Narihiko
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2019, 58
  • [36] V/Al-based ohmic contact formation to n-GaN using low temperature annealing
    Tone, K.
    Tokuda, H.
    Kuzuhara, M.
    2013 IEEE INTERNATIONAL MEETING FOR FUTURE OF ELECTRON DEVICES, KANSAI (IMFEDK2013), 2013,
  • [37] High Performance p-GaN/Oxide Layer/n-GaN Ultraviolet Detector Fabricated by Directly Contacting Method
    Liu, Bang
    Yu, Naisen
    Liu, Dedi
    Liu, Benkang
    Wu, Yunfeng
    Qi, Yan
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2020, 20 (12) : 7553 - 7557
  • [38] Structural and electrical investigation of Al/Ti/TiN/Au based N-face n-GaN contact stack
    Fogarassy, Zsolt
    Wojcicka, Aleksandra
    Cora, Ildiko
    Racz, Adel Sarolta
    Grzanka, Szymon
    Dodony, Erzsebet
    Perlin, Piotr
    Borysiewicz, Michal A.
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2024, 175
  • [39] Comparative studies of GaN, n-GaN and n plus -GaN contact layers on GaN/ c-Al2O3 virtual substrates synthesized by PA MBE
    Seredin, P. V.
    Goloshchapov, D. L.
    Kostomakha, D. E.
    Peshkov, Y. A.
    Buylov, N. S.
    Ivkov, S. A.
    Mizerov, A. M.
    Timoshnev, S. N.
    Sobolev, M. S.
    Ubyivovk, E. V.
    Zemlyakov, V. I.
    OPTICAL MATERIALS, 2024, 152
  • [40] Microstructural, electrical and carrier transport properties of Au/NiO/n-GaN heterojunction with a nickel oxide interlayer
    Reddy, V. Rajagopal
    Reddy, P. R. Sekhar
    Reddy, I. Neelakanta
    Choi, Chel-Jong
    RSC ADVANCES, 2016, 6 (107): : 105761 - 105770