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- [21] Development of Novel Intermetallic Joints using Thin Film Indium Based Solder by Low Temperature Bonding Technology for 3D IC Stacking 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 333 - 338
- [22] Nanoscale Engineering of Graphene-Viologen Based 3D Covalent Organic Polymer Interfaces Leading to Efficient Charge-Transfer for Pseudocapacitive Energy Storage CHEMISTRYSELECT, 2019, 4 (27): : 8089 - 8094
- [23] Germanium Layer Transfer with Low Temperature Direct Bonding and Epitaxial Lift-off Technique for Ge-based monolithic 3D integration 2019 SILICON NANOELECTRONICS WORKSHOP (SNW), 2019, : 9 - 10
- [28] An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging-based on nano InSnBiZnAg particles JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2024, 30 : 5622 - 5631
- [29] Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1199 - 1204
- [30] Numerical analysis of the reliability of Cu/low-k bond pad interconnections under wire pull test: Application of a 3D energy based failure criterion EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 271 - +