Particle removal from semiconductor wafers by megasonic cleaning

被引：0
|
作者：
Kuehn, T.H. [1 ]
Kittelson, D.B. [1 ]
Wu, Y. [1 ]
Gouk, R. [1 ]
机构：
[1] Univ of Minnesota, Minneapolis, MN, United States
来源：
| / Pergamon Press Inc, Tarrytown卷 / 27期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Influence of temperature and dissolved air on megasonic particle removal
    Kuehn, TH
    Yang, CH
    Kittelson, DB
    PARTICLES OF SURFACES 7: DETECTION, ADHESION AND REMOVAL, 2002, : 355 - 376
  • [32] Laser assisted particle removal from silicon wafers
    Mosbacher, M
    Münzer, HJ
    Bertsch, M
    Dobler, V
    Chaoui, N
    Siegel, J
    Oltra, R
    Bäuerle, D
    Boneberg, J
    Leiderer, P
    PARTICLES OF SURFACES 7: DETECTION, ADHESION AND REMOVAL, 2002, : 275 - 293
  • [33] Removal of Cu and Fe Impurities on Silicon Wafers from Cleaning Solutions
    Kim, In-Jung
    Bae, So-Ik
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2006, 16 (02): : 80 - 84
  • [34] Megasonic cleaning of wafers in electrolyte solutions: Possible role of electro-acoustic and cavitation effects
    Keswani, M.
    Raghavan, S.
    Deymier, P.
    Verhaverbeke, S.
    MICROELECTRONIC ENGINEERING, 2009, 86 (02) : 132 - 139
  • [35] SHF Plasma Removal of Photoconductive Coatings from Semiconductor Wafers
    Bordusov, S.V.
    Journal of Applied Spectroscopy, 2001, 68 (06) : 1026 - 1029
  • [36] Design, Fabrication, and Performance Test of a Quartz Horn Megasonic Waveguide for Semiconductor Cleaning
    Kim, Hyunse
    Lee, Yanglae
    Lim, Euisu
    SEMICONDUCTOR CLEANING SCIENCE AND TECHNOLOGY 12 (SCST 12), 2011, 41 (05): : 115 - 120
  • [37] Influence of Subharmonics on Megasonic Cleaning
    Higuchi, Ayumi
    CLEANING AND SURFACE CONDITIONING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING 11, 2009, 25 (05): : 319 - 325
  • [38] Particle removal mechanism of hydrogenated ultrapure water with megasonic irradiation
    Morita, Hiroshi
    Ida, Jun-Ichi
    Ota, Osamu
    Tsukamoto, Kazumi
    Ohmi, Tadahiro
    Solid State Phenomena, 2000, 76-77 : 245 - 249
  • [39] Nano-particle laser removal from silicon wafers
    Lee, JM
    Cho, SH
    Kim, TH
    Park, JG
    Busnaina, AA
    FOURTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, 2003, 5063 : 441 - 444
  • [40] Laser-induced particle removal from silicon wafers
    Leiderer, P
    Boneberg, J
    Dobler, V
    Mosbacher, M
    Münzer, HJ
    Chaoui, N
    Siegel, J
    Solis, J
    Afonso, CN
    Fourrier, T
    Schrems, G
    Bäuerle, D
    HIGH-POWER LASER ABLATION III, 2000, 4065 : 249 - 259
12345