Compression flow modeling of underfill encapsulants for low cost flip-chip assembly

被引：0
|
作者：
Pascarella, Nathan W. [1 ]
Baldwin, Daniel F. [1 ]
机构：
[1] GenRad Inc, Westford, MA, United States
来源：
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1998年 / 21卷 / 04期
关键词：
Manuscript received May 1; 1998; revised September 19; 1998. This work was presented in part at the 48th Electronic Components and Technology Conference; Seattle; WA; May 1998. This work was supported in part by the National Science Foundation under Grant EEC9 402 723. N. W. Pascarella is with GenRad Inc; Westford; MA 01886-0033 USA. D. F. Baldwin is with the Georgia Institute of Technology; Atlanta; GA 30332-0405 USA. Publisher Item Identifier S 1083-4400(98)09655-7;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
9
引用
收藏
页码：325 / 335
相关论文
共 50 条
  • [41] No-clean assembly process conditions - Effects on flip-chip/underfill reliability
    Todd, M
    Costello, K
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 42 - 45
  • [42] An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation
    Wan, JW
    Zhang, WJ
    Bergstrom, DJ
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (03): : 481 - 487
  • [43] Thermal characterization of a no-flow underfill material for flip-chip applications
    He, Y
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 229 : U1112 - U1113
  • [44] Heat resistant underfill for flip-chip packaging
    Kim, W
    Bae, JW
    MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 2002, 374 : 409 - 414
  • [45] Low-cost flip-chip on board
    Philips Cent for Manufacturing, Technology, Eindhoven, Netherlands
    IEEE Trans Compon Packag Manuf Technol Part B Adv Packag, 4 (736-746):
  • [46] Low-Cost E-band Flip-Chip Assembly and Materials
    Boustedt, Katarina
    Ligander, Per
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 702 - 706
  • [47] Low-cost flip-chip on board
    Baggerman, AFJ
    Caers, JFJM
    Wondergem, JJ
    Wagemans, AG
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (04): : 736 - 746
  • [48] Stresses and fracture at the chip/underfill interface in flip-chip assemblies
    Park, JE
    Jasiuk, I
    Zubelewicz, A
    JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (01) : 44 - 52
  • [49] Effects of substrate design on underfill voiding using the low cost, high throughput flip chip assembly process and no-flow underfill materials
    Milner, D
    Paydenkar, C
    Baldwin, DF
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (02): : 107 - 112
  • [50] Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
    Hashimoto, Tomohisa
    Shin-Ichiro, Tanifuji
    Morinishi, Koji
    Satofuka, Nobuyuki
    COMPUTERS & FLUIDS, 2008, 37 (05) : 520 - 523
12345