Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

被引：21

作者：

Hashimoto, Tomohisa ^{[4
]}

Shin-Ichiro, Tanifuji ^{[3
]}

Morinishi, Koji ^{[2
]}

Satofuka, Nobuyuki ^{[1
]}

机构：

[1] Univ Shiga Prefecture, Shiga 5228533, Japan

[2] Kyoto Inst Technol, Dept Mech & Syst Engn, Kyoto 6068585, Japan

[3] Plamedia Corp, Nakano Ku, Tokyo 1640012, Japan

[4] Kyoto Inst Technol, Venture Lab, Sakyo Ku, Kyoto 6068585, Japan

来源：

COMPUTERS & FLUIDS | 2008年 / 37卷 / 05期

关键词：

D O I：

10.1016/j.compfluid.2007.07.007

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the cavity with solder bump by the surface tension with an effect of contact angle as the capillary action. In the no-flow type, the movement of IC chip during the reflow attachment is controlled by an appropriate loading to get the proper interconnect between IC chip and substrate. In both types, the flow behavior and filling time of underfill material in underfilling encapsulation process are investigated, taking the fluid dynamic force acting on the solder bump into account. It is found that the proposed analytical models have a considerable potential for predicting the underfill flow. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：520 / 523

页数：4

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