Compression flow modeling of underfill encapsulants for low cost flip-chip assembly

被引：0
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作者：
Pascarella, Nathan W. [1 ]
Baldwin, Daniel F. [1 ]
机构：
[1] GenRad Inc, Westford, MA, United States
来源：
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1998年 / 21卷 / 04期
关键词：
Manuscript received May 1; 1998; revised September 19; 1998. This work was presented in part at the 48th Electronic Components and Technology Conference; Seattle; WA; May 1998. This work was supported in part by the National Science Foundation under Grant EEC9 402 723. N. W. Pascarella is with GenRad Inc; Westford; MA 01886-0033 USA. D. F. Baldwin is with the Georgia Institute of Technology; Atlanta; GA 30332-0405 USA. Publisher Item Identifier S 1083-4400(98)09655-7;
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摘要：
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页码：325 / 335
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