Study on the ductile mode cutting of LiNbO3 wafer for fabrication of SAW device

被引：0
|
作者：
Shizuka H. [1 ]
Okuda K. [1 ]
Nunobiki M. [1 ]
Li W. [1 ]
Inaoka T. [2 ]
机构：
[1] Graduate School of Engineering, University of Hyogo, Shosha 2167, Himeji, Hyogo
[2] Department of Mechanical and Systems Engineering, University of Hyogo, Shosha 2167, Himeji, Hyogo
来源：
International Journal of Abrasive Technology | 2011年 / 4卷 / 03期
关键词：
Diamond cutting; Ductile mode; Lithium niobate; Single crystal diamond; Surface acoustic wave;
D O I：
10.1504/IJAT.2011.042827
中图分类号：
学科分类号：
摘要：
This paper describes the cutting characteristics of lithium niobate, which is used for surface acoustic wave type micro pumps, regarding the formation of micro grooves by direct cutting. Since lithium niobate is a brittle material with a strong crystal orientation dependency, significant differences were observed in the characteristics of the finished surface according to different directions of cutting. The ductile mode cutting of lithium niobate was found to be feasible with cutting depths of approximately 5 μm or less. Also, results of the study show the feasibility of the formation of minute grooves through the cutting of lithium niobate, using milling with an end mill. © 2011 Inderscience Enterprises Ltd.
引用
收藏
页码：191 / 203
页数：12
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