Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

被引：0
|
作者：
Yu, Da-Quan [1 ]
Lee, Chengkuo [1 ,2 ]
Yan, Li Ling [1 ]
Thew, Meei Ling [1 ]
Lau, John H. [1 ]
机构：
[1] Institute of Microelectronics, ASTAR (Agency for Science, Technology and Research), 11 Science Pk. Road, Singapore Science Pk. II, Singapore, 117685, Singapore
[2] Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117576, Singapore
来源：
Journal of Alloys and Compounds | 2009年 / 485卷 / 1-2期
关键词：
34;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：444 / 450
相关论文
共 50 条
  • [41] Design and characterization of a novel low temperature wafer level bonding technology
    Zhu, Chunsheng
    Zhang, Lichao
    Zhong, Jingxin
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [42] High performance Sn-Cu low temperature bonding based on graphene interlayer
    Yang, Wenhua
    Huang, Xin
    Yin, Xiang
    Wang, Wei
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [43] Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates
    J. Peng
    R. C. Wang
    H. S. Liu
    J. Y. Li
    Journal of Materials Science: Materials in Electronics, 2018, 29 : 313 - 322
  • [44] Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
    Golim, Obert
    Vuorinen, Vesa
    Wernicke, Tobias
    Pawlak, Marta
    Paulasto-Krockel, Mervi
    MICROELECTRONIC ENGINEERING, 2024, 286
  • [45] Process, reliability test and interfacial characterization for low temperature wafer direct bonding
    Lin, Xiaohui
    Shi, Tielin
    Tang, Zirong
    Liao, Guanglan
    Nie, Lei
    3RD INTERNATIONAL SYMPOSIUM ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: OPTICAL TEST AND MEASUREMENT TECHNOLOGY AND EQUIPMENT, PARTS 1-3, 2007, 6723
  • [46] Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing
    Kurashima, Yuichi
    Maeda, Atsuhiko
    Takagi, Hideki
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2016, 55 (01)
  • [47] A dynamic study for wafer-level bonding strength uniformity in low-temperature wafer bonding
    Zhang, XX
    Raskin, JP
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2005, 8 (10) : G268 - G270
  • [48] Hermetic Packaging Based on Cu-Sn and Au-Au Dual Bonding for High-Temperature Graphene Pressure Sensor
    Wang, Junqiang
    Zhang, Haikun
    Chen, Xuwen
    Li, Mengwei
    MICROMACHINES, 2022, 13 (08)
  • [49] Low temperature Al based wafer bonding using Sn as intermediate layer
    Zhu, Zhiyuan
    Yu, Min
    Zhu, Yingwei
    Wang, Peiquan
    Liu, Chenchen
    Wang, Wei
    Miao, Min
    Chen, Jing
    Jin, Yufeng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 127 - 130
  • [50] Low Temperature Bonding Using Sub-micron Au Particles for Wafer-level MEMS Packaging
    Ito, Shin
    Mizuno, Jun
    Ishida, Hiroyuki
    Ogashiwa, Toshinori
    Kanehira, Yukio
    Murai, Hiroshi
    Wakai, Fumihiro
    Shoji, Shuichi
    2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
12345