Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

被引：0
|
作者：
Yu, Da-Quan [1 ]
Lee, Chengkuo [1 ,2 ]
Yan, Li Ling [1 ]
Thew, Meei Ling [1 ]
Lau, John H. [1 ]
机构：
[1] Institute of Microelectronics, ASTAR (Agency for Science, Technology and Research), 11 Science Pk. Road, Singapore Science Pk. II, Singapore, 117685, Singapore
[2] Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117576, Singapore
来源：
Journal of Alloys and Compounds | 2009年 / 485卷 / 1-2期
关键词：
34;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：444 / 450
相关论文
共 50 条
  • [21] Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging
    Marauska, S.
    Claus, M.
    Lisec, T.
    Wagner, B.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (08): : 1119 - 1130
  • [22] Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging
    S. Marauska
    M. Claus
    T. Lisec
    B. Wagner
    Microsystem Technologies, 2013, 19 : 1119 - 1130
  • [23] High Temperature Pressure Sensor Using Cu-Sn Wafer Level Bonding
    Liu, G. D.
    Gao, C. C.
    Zhang, Y. X.
    Hao, Y. L.
    2015 IEEE SENSORS, 2015, : 1689 - 1692
  • [24] Low Temperature Wafer Level Au-Au Bonding for Heterogeneous Integration
    Wang, Fei
    Dai, Jiayun
    Cui, Dongyi
    Kong, Yuechan
    2021 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2021, : 151 - 153
  • [25] Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
    Fan, J.
    Peng, L.
    Li, K. H.
    Tan, C. S.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (10)
  • [26] Low Temperature Bonding with Wafer Level Nanocrystalline Cu Film
    Chiu, Wei-Lan
    Chiang, Chia-Wen
    Chang, Hsiang-Hung
    2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021), 2021, : 97 - 98
  • [27] Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
    Hotchkiss, Joseph
    Vuorinen, Vesa
    Dong, Hongqun
    Ross, Glenn
    Kaaos, Jani
    Paulasto-Krockel, Mervi
    Wernicke, Tobias
    Poenninger, Anneliese
    2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
  • [28] Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
    Thi-Thuy Luu
    Ani Duan
    Knut E. Aasmundtveit
    Nils Hoivik
    Journal of Electronic Materials, 2013, 42 : 3582 - 3592
  • [29] Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
    Thi-Thuy Luu
    Duan, Ani
    Aasmundtveit, Knut E.
    Hoivik, Nils
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (12) : 3582 - 3592
  • [30] STUDY OF LOW-TEMPERATURE WAFER BONDING WITH Au-Au BONDING TECHNIQUE
    Kurotaki, H.
    Shinohara, H.
    Kobayashi, H.
    Mizuno, J.
    Shoji, S.
    MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, : 747 - 748
12345