共 50 条
- [41] Wire bonding and Reliability Challenges of Gel Filled TPMS Packaging PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 288 - 291
- [42] Pd Effects on the Reliability in the Low Cost Ag Bonding Wire 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1541 - 1546
- [44] Influence of Al/CucorAl wire bonding on reliability of SiC devices 2021 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2021), 2021, : 259 - 263
- [45] Influence of Wire-Bonding Layout on Reliability in IGBT Module 2020 22ND EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'20 ECCE EUROPE), 2020,
- [46] Reliability of Circuits Under Pads for Au and Cu Wire Bonding 2012 19TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2012,
- [47] Reliability Evaluation of Bonding between Cu Wire and Al Pad 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 630 - 633
- [49] Molded Reliability Study for Different Cu Wire Bonding Configurations 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1587 - 1594
- [50] The Analysis of Wire Bonding Reliability under Critical Operating Conditions 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2020,