RESEARCH ON THE RELIABILITY OF WIRE BONDING IN HUMID ENVIRONMENTS

被引：0
|
作者：
Zhang, Xiaowen [1 ]
Ling, Xiaolin [1 ]
Gao, Ru [1 ]
机构：
[1] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, 110 DongGuangZhuang Road, Guangzhou, China
来源：
IET Conference Proceedings | 2023年 / 2023卷 / 09期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Alumina - Chemical bonds - Chemical reactions - Failure (mechanical) - Failure analysis - Passivation - Wire
引用
收藏
页码：696 / 700
相关论文
共 50 条
  • [31] Research on Strength Descent of Wire Bonding in the Packing
    Zhang Dezheng
    Bao Shengxiang
    Ma Lili
    Lv Dechun
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 381 - 383
  • [32] Research Progress on Bonding Wire for Microelectronic Packaging
    Zhou, Hongliang
    Zhang, Yingchong
    Cao, Jun
    Su, Chenghao
    Li, Chong
    Chang, Andong
    An, Bin
    MICROMACHINES, 2023, 14 (02)
  • [33] Wire Bonding of Cu and Pd Coated Cu Wire: Bondability, Reliability, and IMC Formation
    Qin, Ivy
    Xu, Hui
    Clauberg, Horst
    Cathcart, Ray
    Acoff, Viola L.
    Chylak, Bob
    Huynh, Cuong
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1489 - 1495
  • [34] Reliability of Cu Wire Bonding on Active Area for Automotive Applications
    Thomas, Sven
    Reynoso, Dexter
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 363 - 368
  • [35] Effect of Impact Force Towards Cu Wire Bonding Reliability
    Chia, Lee Cher
    Yau, Chua Kok
    Chee, Tan Sze
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [36] AuAg Alloy wire bonding process capability and reliability assessment
    Chian, Lim Chee
    Hoo, Goh koh
    IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, : 158 - 158
  • [37] Novel Coated Silver (Ag) Bonding Wire: Bondability and Reliability
    Kumar, Balasubramanian Senthil
    Murali, Sarangapani
    Tae, Kang Il
    Evonne, Lim Yee Weon
    Wei, Tok Chee
    James, Kim Tae Yeop
    Eric, Tan Swee Seng
    Xi, Zhang
    2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
  • [38] Evaluation of bondability and reliability of single crystal copper wire bonding
    Chen, Hua
    Lee, S. W. Ricky
    Ding, Yutian
    Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, : 238 - 244
  • [39] Reliability considerations for ESD protection under wire bonding pads
    Anderson, WR
    Gonzalez, WM
    Knecht, SS
    Fowler, W
    MICROELECTRONICS RELIABILITY, 2001, 41 (03) : 367 - 373
  • [40] An investigation into the effects of probing and wire bonding stress on the reliability of BOAC
    Chen, KM
    Wu, BC
    Tang, KH
    Cheng, FY
    Kao, NH
    Lai, JY
    MICROELECTRONICS RELIABILITY, 2006, 46 (2-4) : 335 - 342
12345