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- [11] Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer The International Journal of Advanced Manufacturing Technology, 2017, 92 : 4073 - 4080
- [12] Reliability characterization of heavy wire bonding materials 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
- [13] Reliability of Cu wire bonding to Al metallization 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1604 - +
- [14] Bonding Wire Options and Their Impact on Product Reliability 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 835 - 841
- [17] Research on Wire Feeding Device of Wire Bonding Machine 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [18] RELIABILITY OF PLASTIC ENCAPSULATED INTEGRATED CIRCUITS IN HUMID ENVIRONMENTS. ATR, Australian Telecommunication Research, 1986, 20 (02): : 39 - 50
- [19] THE RELIABILITY OF PLASTIC ENCAPSULATED INTEGRATED-CIRCUITS IN HUMID ENVIRONMENTS AUSTRALIAN TELECOMMUNICATION RESEARCH, 1986, 20 (02): : 39 - 50
- [20] Chlorine and sulfur effects on silver bonding wire reliability 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,