RESEARCH ON THE RELIABILITY OF WIRE BONDING IN HUMID ENVIRONMENTS

被引：0
|
作者：
Zhang, Xiaowen [1 ]
Ling, Xiaolin [1 ]
Gao, Ru [1 ]
机构：
[1] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, 110 DongGuangZhuang Road, Guangzhou, China
来源：
IET Conference Proceedings | 2023年 / 2023卷 / 09期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Alumina - Chemical bonds - Chemical reactions - Failure (mechanical) - Failure analysis - Passivation - Wire
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页码：696 / 700
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