RELIABILITY AND OPTIMIZATION OF WIRE BONDING IN POWER MICROELECTRONIC DEVICES

被引：0
|
作者：
El Hami, Norelislam [1 ]
Koulou, Aicha [2 ]
El Hami, Abdelkhalak [3 ]
机构：
[1] Science and Engineering Laboratory, ENSA, University Ibn Tofail, Kénitra, Morocco
[2] EST, University Ibn Tofail, Kénitra, Morocco
[3] Laboratory of Mechanics of Normandy, INSA, Rouen, France
来源：
Electronic Device Failure Analysis | 2024年 / 26卷 / 03期
关键词：
D O I：
10.31399/asm.edfa.2024-3.p028
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页码：28 / 34
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