RELIABILITY AND OPTIMIZATION OF WIRE BONDING IN POWER MICROELECTRONIC DEVICES

被引：0
|
作者：
El Hami, Norelislam [1 ]
Koulou, Aicha [2 ]
El Hami, Abdelkhalak [3 ]
机构：
[1] Science and Engineering Laboratory, ENSA, University Ibn Tofail, Kénitra, Morocco
[2] EST, University Ibn Tofail, Kénitra, Morocco
[3] Laboratory of Mechanics of Normandy, INSA, Rouen, France
来源：
Electronic Device Failure Analysis | 2024年 / 26卷 / 03期
关键词：
D O I：
10.31399/asm.edfa.2024-3.p028
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：28 / 34
相关论文
共 50 条
  • [31] Reliability considerations of III-nitride microelectronic devices
    Würfl, J
    Abrosimova, V
    Hilsenbeck, J
    Nebauer, E
    Rieger, W
    Tränkle, G
    MICROELECTRONICS RELIABILITY, 1999, 39 (12) : 1737 - 1757
  • [32] Reliability behavior of microelectronic devices illustrated by two examples
    Kurt, J.
    Periodica Polytechnica Mechanical Engineering, 1988, 32 (01): : 73 - 85
  • [33] The Reliability Evaluation of the Bonding Wire in the DC/DC Power Under the Environment of Humidity
    Zhang XiaoWen
    He Xiaoqi
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1357 - 1359
  • [34] Numerical simulation of the wire bonding reliability of IGBT module under power cycling
    Bie Xiaorui
    Qin Fei
    An Tong
    Zhao Jingyi
    Fang Chao
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1396 - 1401
  • [35] HIGH RELIABILITY ALUMINUM WIRE BONDING
    PLOUGH, C
    DAVIS, D
    LAWLER, H
    PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1969, : 157 - &
  • [36] Reliability Criteria for Thick Bonding Wire
    Dagdelen, Turker
    Abdel-Rahman, Eihab
    Yavuz, Mustafa
    MATERIALS, 2018, 11 (04):
  • [37] A Breakthrough in Power Electronics Reliability - New Die Attach and Wire Bonding Materials
    Krebs, Thomas
    Duch, Susanne
    Schmitt, Wolfgang
    Koetter, Steffen
    Prenosil, Peter
    Thomas, Sven
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1746 - 1752
  • [38] The Topical Issues on the Advancement and Reliability of Novel Microelectronic Devices
    Gu, Wengang
    Fang, Wenxiao
    PROCEEDINGS OF 2016 11TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS'2016): INTEGRATING BIG DATA, IMPROVING RELIABILITY & SERVING PERSONALIZATION, 2016,
  • [39] Effects of Thick Al Wires Bonding Layout on Reliability of Power Devices
    Liu, Hailong
    Yang, Shaohua
    Tang, Wulei
    Zheng, Gangtao
    2011 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE), 2011, : 509 - 513
  • [40] Ultrasonic Engineering Co., Ltd.: Wire bonding for power devices
    Journal of the Institute of Electrical Engineers of Japan, 2020, 140 (10): : 639 - 642
12345