共 50 条
- [41] Strength, Toughness and Microstructure of Wedge Bonding Gold Wire Xiyou Jinshu/Chinese Journal of Rare Metals, 2022, 46 (11): : 1526 - 1532
- [44] Clean bonding surfaces in wire bonding JOT, Journal fuer Oberflaechentechnik, 2022, 62 (10): : 66 - 67
- [45] Research on the force-position switching control system of wire bonding head on DSP SENSORS, MECHATRONICS AND AUTOMATION, 2014, 511-512 : 1118 - +
- [46] Sensors for automatic process control of wire bonding ISAF '96 - PROCEEDINGS OF THE TENTH IEEE INTERNATIONAL SYMPOSIUM ON APPLICATIONS OF FERROELECTRICS, VOLS 1 AND 2, 1996, : 991 - 994
- [47] Sensors for ultrasonic wire bonding process control FERROELECTRICS, 1999, 232 (1-4) : 1091 - 1096
- [48] Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (01): : 65 - 70
- [49] Effect of the properties of gold wire on the ability of low-looped wire bonding ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 316 - +
- [50] Effects of Thermal Cycling on the Mechanical Properties of Gold Wire Bonding 2014 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE), 2014, : 521 - 524