共 50 条
- [22] Smith-ADRC Based Z Axis Impact Force Control for High Speed Wire Bonding Machine 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1003 - 1008
- [23] Application of a force sensor in wire bonding process Sensors and Transducers, 2013, 159 (11): : 345 - 350
- [24] MODEL ANALYZING FOR REUSING GOLD WIRE CAPILLARY IN THE GOLD WIRE BONDING PROCESS IIUM ENGINEERING JOURNAL, 2021, 22 (02): : 306 - 315
- [26] Fuzzy PID Control for Impact Force of High Speed Wire Bonding Process 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 47 - 52
- [28] Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding Journal of Electronic Materials, 2004, 33 : 300 - 311
- [30] Gold wire bonding to nickel palladium plated leadframes PLATING AND SURFACE FINISHING, 2001, 88 (07): : 54 - 58