共 50 条
- [33] Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder joints on Cu Pads with Different Solder Volumes 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 684 - +
- [34] DYNAMIC RECRYSTALLIZATION of Sn3.0Ag0.5Cu Pb-FREE SOLDER ALLOY IMECE2008: PROCEEDINGS OF THE INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2008, VOL 6, 2009, : 163 - 169
- [39] Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints Journal of Materials Science: Materials in Electronics, 2019, 30 : 6224 - 6233
- [40] Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects Journal of Materials Science: Materials in Electronics, 2017, 28 : 10785 - 10793