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- [26] Effects of POSS-Silanol Addition on the Whisker Formation in Sn3.0Ag0.5Cu Pb-Free Solder 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 765 - 768
- [27] Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure Journal of Materials Science: Materials in Electronics, 2019, 30 : 14077 - 14084