Low-Temperature Pressureless Sintering Properties of Submicron Silver Pastes

被引：0
|
作者：
Xin, Li [1 ]
Zhiwei, Wang [1 ]
机构：
[1] School of Materials Science and Engineering, Tianjin University, Tianjin,300350, China
来源：
Tianjin Daxue Xuebao (Ziran Kexue yu Gongcheng Jishu Ban)/Journal of Tianjin University Science and Technology | 2024年 / 57卷 / 09期
关键词：
Sintered silver pastes show excellent properties such as high thermal conductivity; high electrical conductivity; low elastic modulus; and high reliability; allowing them to maximize the potential of SiC and GaN devices; thus; these pastes have broad application prospects. To reduce the preparation cost and improve the sintering performance of the silver pastes; three types of sintered silver pastes were prepared using two types of submicron silver particles:spherical and flaky. The sintering properties of submicron silver particles with different morphologies and mixed particles were examined by analyzing the electrical resistivity; shear strength; and microscopic morphology of the silver pastes sintered at 200 —250 ℃ without pressure. The silver paste prepared from spherical silver particles showed a high shear strength of 52.4 MPa after sintering at 250 ℃; and its electrical resistivity was only 6.28× 10-8 Ω·m. The silver paste prepared from silver flakes showed a low shear strength and high electrical resistivity after sintering. When the silver paste prepared from silver flakes was sintered at 250 ℃; the shear strength was 21.5 MPa; and the electrical resistivity was 15.54×10-8 Ω·m; which was attributed to the large radial size of the silver flakes; low tap density; and sintering structure of the silver flakes stacked in layers. The silver paste with mixed particles showed potential for sintering at 200 ℃; with a shear strength of 28.2 MPa and electrical resistivity of 7.77×10-8 Ω·m; which was attributed to the silver flakes. The submicron silver flakes promoted faster evaporation of the selected organic components and a higher initial packing density of the mixed particles. These results contributed to the mature and stable preparation of submicron silver pastes and provided a new approach for developing high-performance silver pastes with low-temperature pressure-less sintering properties. © 2024 Tianjin University. All rights reserved;
D O I：
10.11784/tdxbz202305036
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页码：974 / 981
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