Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression molding

被引：0
|
作者：
机构：
[1] Suzuki, Kosuke
[2] Sanada, Yuki
[3] Uchibori, Shinya
[4] Kashiwazaki, Atsushi
[5] Imada, Masaji
来源：
| 2017年 / Institute of Electrical and Electronics Engineers Inc., United States卷
关键词：
D O I：
7939379
中图分类号：
学科分类号：
摘要：
Printed circuit boards
引用
收藏
相关论文
共 50 条
  • [41] Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration
    Wang, Chenyuan
    He, Yigang
    Wang, Chuankun
    Li, Lie
    Wu, Xiaoxin
    ELECTRONICS, 2020, 9 (10) : 1 - 17
  • [42] A multi-chip synchronization system based on diversity technique
    Zhang Jun-an
    Li Guang-jun
    Fu Dong-bing
    Zhang Rui-tao
    Yang Yu-jun
    Wei Ya-feng
    Liu Jun
    Li Jiao-xue
    PROCEEDINGS OF THE 2015 JOINT INTERNATIONAL MECHANICAL, ELECTRONIC AND INFORMATION TECHNOLOGY CONFERENCE (JIMET 2015), 2015, 10 : 496 - 500
  • [43] Finite element analysis of plastic-encapsulated Multi-Chip Packages
    Tay, AAO
    Ong, SH
    Lee, LW
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 170 - 176
  • [44] Finite element analysis of plastic-encapsulated Multi-Chip Packages
    Natl Univ of Singapore, Singapore, Singapore
    Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 170 - 176
  • [45] Golden Bump Based Flip-Chip Interconnection for Superconducting Multi-Chip Module
    Li, Kun
    Xu, Gaowei
    Zhao, Wenbo
    Xiao, Kelaiti
    Ren, Jie
    Wang, Zhen
    Xie, Xiaoming
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2023, 33 (05)
  • [46] EXPERIMENTAL AND NUMERICAL INVESTIGATION OF SINGLE-PHASE LIQUID COOLING FOR HETEROGENEOUS INTEGRATION MULTI-CHIP MODULE
    Gharaibeh, Ahmad R.
    Soud, Qusai
    Manaserh, Yaman
    Tradat, Mohammed
    Sammakia, Bahgat
    PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
  • [47] Thermal design and analysis of multi-chip LED module with ceramic substrate
    Yin, Luqiao
    Yang, Lianqiao
    Yang, Weiqiao
    Guo, Yansheng
    Ma, Kejun
    Li, Shuzhi
    Zhang, Jianhua
    SOLID-STATE ELECTRONICS, 2010, 54 (12) : 1520 - 1524
  • [48] Superconducting Molybdenum Multi-Chip Module Approach for Cryogenic and Quantum Applications
    Shah, Archit
    Peek, Sherman E.
    Yelamanchili, Bhargav
    Gupta, Vaibhav
    Tuckerman, David B.
    Cantaloube, Chris
    Sellers, John A.
    Hamilton, Michael C.
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 276 - 282
  • [49] Behavioral Modeling for Stability in Multi-Chip Power Modules
    Mazzola, Michael
    Rahmani, Maryam
    Gafford, James
    Lemmon, Andrew
    Graves, Ryan
    2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 87 - 90
  • [50] Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module
    Lee, K-W
    Kanno, S.
    Ohara, Y.
    Kiyoyama, K.
    Bea, J-C
    Fukushima, T.
    Tanaka, T.
    Koyanagi, M.
    2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 6 - +
12345