Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression molding

被引：0
|
作者：
机构：
[1] Suzuki, Kosuke
[2] Sanada, Yuki
[3] Uchibori, Shinya
[4] Kashiwazaki, Atsushi
[5] Imada, Masaji
来源：
| 2017年 / Institute of Electrical and Electronics Engineers Inc., United States卷
关键词：
D O I：
7939379
中图分类号：
学科分类号：
摘要：
Printed circuit boards
引用
收藏
相关论文
共 50 条
  • [31] Microring-based multi-chip WDM photonic module
    Shubin, Ivan
    Zheng, Xuezhe
    Thacker, Hiren
    Djordjevic, Stevan S.
    Lin, Shiyun
    Amberg, Philip
    Yao, Jin
    Lexau, Jon
    Chang, Eric
    Liu, Frankie
    Park, Namseok
    Raj, Kannan
    Ho, Ron
    Cunningham, John E.
    Krishnamoorthy, Ashok V.
    OPTICS EXPRESS, 2015, 23 (10): : 13172 - 13184
  • [32] Special issue on multi-chip module testing and design for testability
    Agrawal, VD
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 1997, 10 (1-2): : 5 - 5
  • [33] Miniaturizing power electronics using multi-chip module technology
    Porter, E
    Ang, S
    Burgers, K
    Glover, M
    Olejniczak, K
    Schaper, L
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 329 - 333
  • [34] High Density Multi-Chip Module for Photonic Reservoir Computing
    Heroux, Jean Benoit
    Yamane, Toshiyuki
    Numata, Hidetoshi
    Nakano, Daiju
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 231 - 236
  • [35] Simulation and analysis of thermal distribution in compact multi-chip module
    Cui, Haoyang
    Xu, Yongpeng
    Liu, Can
    Tang, Naiyun
    Chu, Fenghong
    Tang, Zhong
    APPLIED SCIENCE, MATERIALS SCIENCE AND INFORMATION TECHNOLOGIES IN INDUSTRY, 2014, 513-517 : 3111 - 3114
  • [36] Package embedded heat exchanger for stacked multi-chip module
    Lee, H
    Jeong, Y
    Shin, J
    Baek, J
    Kang, MK
    Chun, KJ
    SENSORS AND ACTUATORS A-PHYSICAL, 2004, 114 (2-3) : 204 - 211
  • [37] Incorporating Multi-Chip Module packaging constraints into system design
    Garg, V
    Lacy, S
    Schimmel, DE
    Stogner, D
    Ulmer, C
    Wills, DS
    Yalamanchili, S
    EUROPEAN DESIGN & TEST CONFERENCE 1996 - ED&TC 96, PROCEEDINGS, 1996, : 508 - 513
  • [38] Thermal Design of a LED Multi-chip Module for Automotive Headlights
    Qi Lin
    Wang Chunqing
    Tian Yanhong
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1435 - 1438
  • [39] Integral microwave circulators for multi-chip module (MCM) applications
    Krishnamurthy, V
    Whitmore, B
    Paik, K
    1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III: HIGH FREQUENCIES IN HIGH PLACES, 1997, : 1829 - 1832
  • [40] Warpage Tuning Study for Multi-chip Last Fan Out Wafer Level Package
    Li, Hung-Yuan
    Chen, Allen
    Peng, Sam
    Pan, George
    Chen, Stephen
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1384 - 1391
12345