Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression molding

被引：0
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作者：
机构：
[1] Suzuki, Kosuke
[2] Sanada, Yuki
[3] Uchibori, Shinya
[4] Kashiwazaki, Atsushi
[5] Imada, Masaji
来源：
| 2017年 / Institute of Electrical and Electronics Engineers Inc., United States卷
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D O I：
7939379
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摘要：
Printed circuit boards
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