Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

被引：0
|
作者：
Nihon Superior Centre for the Manufacture of Electronic Materials , School of Mechanical and Mining Engineering, University of Queensland, Brisbane [1 ]
QLD
4072, Australia
不详 [2 ]
02600, Malaysia
不详 [3 ]
564-0063, Japan
机构：
来源：
Int. Conf. Electron. Pack., ICEP | 2017年 / 377-380期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Cu substrate - Eutectic microstructure - IMC layer - Lead-free solder alloy - Ni additions - SAC-solders - Solder balls - Solid solution strengthening
引用
收藏
相关论文
共 50 条
  • [41] Microstructure and mechanical properties of Lead-free Sn-Cu solder composites prepared by rapid directional solidification
    Shen, Jun
    Liu, Yongchang
    Han, Yajing
    Gao, Houxiu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (12) : 1235 - 1238
  • [42] Thermodynamic properties of the liquid Ag-Cu-Sn lead-free solder alloys
    Kopyto, Marek
    Onderka, Boguslaw
    Zabdyr, Leszek A.
    MATERIALS CHEMISTRY AND PHYSICS, 2010, 122 (2-3) : 480 - 484
  • [43] Emf Measurements in the Liquid Au-Cu-Sn Lead-free Solder Alloys
    Wierzbicka-Miernik, A.
    Garzel, G.
    Zabdyr, L. A.
    JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2010, 31 (01) : 34 - 36
  • [44] Emf Measurements in the Liquid Au-Cu-Sn Lead-free Solder Alloys
    A. Wierzbicka-Miernik
    G. Garzel
    L. A. Zabdyr
    Journal of Phase Equilibria and Diffusion, 2010, 31 : 34 - 36
  • [45] Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints.
    Islam, MN
    Chan, YC
    Alam, MO
    2005 INTERNATIONAL CONFERENCE ON ASIAN GREEN ELECTRONICS: DESIGN FOR MANUFACTURABILITY AND RELIABILITY, PROCEEDINGS, 2004, : 185 - 191
  • [46] Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys
    Silva, Bismarck L.
    Xavier, Marcella G. C.
    Garcia, Amami
    Spinenlli, Jose E.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 705 : 325 - 334
  • [47] Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application
    Dragana Živković
    Duško Minić
    Dragan Manasijević
    Nadežda Talijan
    Iwao Katayama
    Ana Kostov
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 1130 - 1135
  • [48] Effect of aging on Sn-Bi lead-free solder
    Li, Yuan-Shan
    Chen, Zhen-Hua
    Lei, Xiao-Juan
    Cailiao Kexue yu Gongyi/Material Science and Technology, 2009, 17 (03): : 339 - 342
  • [49] Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys
    Dheeraj Varanasi
    Manoj Kumar Pal
    Powder Metallurgy and Metal Ceramics, 2021, 60 : 504 - 512
  • [50] Corrosion behavior of Sn-based lead-free solder alloys: a review
    Shuai Li
    Xingxing Wang
    Zhongying Liu
    Yongtao Jiu
    Shuye Zhang
    Jinfeng Geng
    Xiaoming Chen
    Shengjin Wu
    Peng He
    Weimin Long
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 9076 - 9090
12345