Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

被引：0
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作者：
Nihon Superior Centre for the Manufacture of Electronic Materials , School of Mechanical and Mining Engineering, University of Queensland, Brisbane [1 ]
QLD
4072, Australia
不详 [2 ]
02600, Malaysia
不详 [3 ]
564-0063, Japan
机构：
来源：
Int. Conf. Electron. Pack., ICEP | 2017年 / 377-380期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
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学科分类号：
摘要：
Cu substrate - Eutectic microstructure - IMC layer - Lead-free solder alloy - Ni additions - SAC-solders - Solder balls - Solid solution strengthening
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